Loading...

TIP145G

Onsemi

TIP145G by Onsemi

TIP145G by Onsemi is a PNP BJT with 125W power dissipation, 60V collector-emitter voltage, and 10A collector current. Ideal for switching applications, it features a Darlington configuration with built-in diode and resistor in a plastic/epoxy package. With a min hFE of 500 and max operating temp of 150 °C, this transistor is suitable for high-power requirements.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,215 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,215

-

-

-

-

Digiode

USA . 613 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

613

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 808 parts In-Stock

1+ parts

$18.020

100+ parts

-

1k+ parts

-

10k+ parts

-

808

$18.020

-

-

-

TANS Electronics

Latvia . 7,393 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,393

-

-

-

-

SupplyDigital Components

Austria . 5,849 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,849

-

-

-

-

Kulean Microsystems

USA . 4,184 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,184

-

-

-

-

Problanco Electronics

Mexico . 2,943 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,943

-

-

-

-

Corphita

USA . 1,644 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,644

-

-

-

-

UHIMA Technologies

Türkiye . 605 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

605

-

-

-

-

Corohmni

South Africa . 381 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

381

-

-

-

-

Overview

Experience the unmatched performance of the TIP145G by Onsemi, a power BJT transistor that sets the standard for reliability and efficiency. With a built-in diode and resistor, this PNP Darlington transistor is perfect for switching applications, offering a maximum collector current of 10A and a minimum DC current gain of 500. Onsemi's reputation for quality shines through in this rectangular package shape with flange mount style, ensuring optimal heat dissipation and long-lasting durability. Elevate your projects with the superior capabilities of the TIP145G, providing exceptional value and benefits to customers seeking top-notch performance in their electronic designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the transistor, making it more reliable and durable.

Polarity or Channel Type: PNP

Suitable for applications where PNP transistors are required, ensuring compatibility with circuit design.

Configuration: DARLINGTON WITH BUILT-IN DIODE AND RESISTOR

Ideal for switching applications as it offers high current gain and built-in protection components.

Transistor Application: SWITCHING

Designed specifically for switching operations, ensuring efficient performance in such applications.

No. of Terminals: 3

Standard configuration for a bipolar junction transistor, making it easy to integrate into circuits.

Maximum Power Dissipation (Abs): 125 W

Can handle high power levels, suitable for applications requiring power switching.

Maximum Collector-Emitter Voltage: 60 V

Suitable for low to medium voltage applications, providing a wide range of operating possibilities.

Maximum Collector Current (IC): 10 A

Capable of handling high current levels, making it suitable for power switching applications.

Nominal Transition Frequency (fT): 4 MHz

Offers fast switching speeds, making it suitable for high-frequency applications.

Technical Specifications

Power Bipolar Junction Transistors (BJT) TIP145G attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

60 V

Minimum DC Current Gain (hFE):

500

JEDEC-95 Code:

TO-218

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

PNP

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

TIP145G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20