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SZEMI7208MUTAG

Onsemi

SZEMI7208MUTAG by Onsemi

SZEMI7208MUTAG by Onsemi is a Data Line Filter with 8 functions and 16 terminals. It features an inductance of 0.017 uH, capacitance of 24.2 uF, and max DC resistance of 10 ohm. Ideal for applications requiring data line filtering, it operates b/w -40 to 85 °C and has a compact surface mount package design.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,708 parts In-Stock

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Vyrian

USA . 787 parts In-Stock

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Problanco Electronics

Mexico . 5,089 parts In-Stock

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SupplyDigital Components

Austria . 3,979 parts In-Stock

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TANS Electronics

Latvia . 3,606 parts In-Stock

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Corphita

USA . 2,475 parts In-Stock

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Kulean Microsystems

USA . 2,085 parts In-Stock

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Corohmni

South Africa . 424 parts In-Stock

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UHIMA Technologies

Türkiye . 383 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the SZEMI7208MUTAG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality data line filters that offer superior functionality and reliability. With 8 functions and 16 terminals, this filter ensures optimal protection and efficiency for your applications. Experience the value of seamless connectivity and enhanced signal quality with the SZEMI7208MUTAG, making it the perfect choice for your electronic needs. Trust Onsemi to provide you with the innovative solutions you need for a seamless user experience.

Feature Benefit Bullets

No. of Functions: 8

Provides multiple filtering functions, ensuring thorough filtration and protection for the connected devices.

No. of Terminals: 16

Allows for versatile connectivity options, enabling compatibility with various devices and setups.

Filter Type: DATA LINE FILTER

Specifically designed for data lines, offering efficient filtering of unwanted noise and interference.

Maximum Operating Temperature: 85 °C

Ensures stable performance even in high-temperature environments, increasing reliability.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, making it suitable for a wide range of operating conditions.

Terminal Finish: MATTE TIN

Provides a durable finish that resists corrosion, ensuring long-term connectivity.

Inductance: 0.017 uH

Offers the right amount of inductance for effective filtering without causing signal degradation.

Width (mm): 1.35

Compact size makes it easy to integrate into various electronic devices without taking up much space.

Maximum DC Resistance: 10 ohm

Low resistance ensures efficient power transfer and minimal energy loss.

Length: 3.3 mm

Ideal length for easy installation and compatibility with different mounting options.

Output Impedance (ohm): 50 OHM

Matched impedance helps in minimizing reflections and ensuring signal integrity.

Packing Method: TR

Tape and reel packaging for convenient handling during mass production and assembly.

Mounting Type: SURFACE MOUNT

Surface mount design allows for efficient PCB integration and saves space in compact devices.

Package Material: PLASTIC

Lightweight and durable plastic material for safe and reliable protection of internal components.

Height: 0.55 mm

Low profile design for minimal PCB footprint and easy incorporation into slim electronic devices.

Capacitance: 24.2 uF

Offers the appropriate capacitance for effective noise suppression and improved signal quality.

Technical Specifications

Data Line Filters SZEMI7208MUTAG attributes and parameters. Explore more Data Line Filters devices from Onsemi

Specs

Capacitance:

24.2 uF

Maximum DC Resistance:

Filter Type:

Height:

.55 mm

Inductance:

.017 uH

JESD-609 Code:

e3

Length:

3.3 mm

Mounting Type:

SURFACE MOUNT

No. of Functions:

8

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Impedance (ohm):

50 OHM

Package Material:

PLASTIC

Packing Method:

TR

Terminal Finish:

MATTE TIN

Width (mm):

1.35

Trade Compliance

SZEMI7208MUTAG Filters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8504.50.80.00

SB

8504.50.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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