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SZEMI4193MTTAG

Onsemi

SZEMI4193MTTAG by Onsemi

SZEMI4193MTTAG by Onsemi is a Data Line Filter with 6 functions and 16 terminals. It offers 85 °C max operating temp, -40°C min operating temp, and 5 ohm max DC resistance. Ideal for IEC-approved applications requiring a compact filter with 32 OHM output impedance and 0.8 uF capacitance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,225 parts In-Stock

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Digiode

USA . 1,033 parts In-Stock

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Problanco Electronics

Mexico . 8,297 parts In-Stock

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Kulean Microsystems

USA . 7,359 parts In-Stock

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TANS Electronics

Latvia . 7,130 parts In-Stock

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Corphita

USA . 1,608 parts In-Stock

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UHIMA Technologies

Türkiye . 966 parts In-Stock

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Corohmni

South Africa . 442 parts In-Stock

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SupplyDigital Components

Austria . 220 parts In-Stock

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Overview

Enhance your electronic devices with the SZEMI4193MTTAG data line filter by Onsemi. Trusted for its quality and reliability, Onsemi brings you a product that offers exceptional performance and efficiency. With 6 functions and 16 terminals, this filter is designed to enhance data transmission while providing protection against interference. Ideal for various applications, this filter ensures a smooth and reliable connection. Upgrade your electronics with the SZEMI4193MTTAG and experience the difference in quality and functionality.

Feature Benefit Bullets

Approvals (V) IEC: 6

Having IEC approvals ensures high standards of quality and safety for the product.

No. of Functions: 6

Having multiple functions allows for more efficient filtering of data lines.

No. of Terminals: 16

More terminals provide versatility in connection options.

Filter Type: DATA LINE FILTER

Specifically designed for data line filtering, ensuring optimal performance for data transmission.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in extreme cold conditions.

Terminal Finish: TIN

Tin finish provides good conductivity and corrosion resistance.

Width (mm): 2.0

Compact width allows for space-saving installation.

Maximum DC Resistance: 5 ohm

Low DC resistance minimizes power loss in the filtering process.

Length: 4 mm

Optimal length for efficient filtering without taking up too much space.

Output Impedance (ohm): 32 OHM

Output impedance matches standard requirements for data line filters.

Packing Method: TR

TR packing method ensures easy handling and storage.

Mounting Type: SURFACE MOUNT

Surface mount installation is convenient and suitable for modern electronic devices.

Rated Current: 0.1 A

Adequate rated current for typical data line filtering applications.

Attenuation At Minimum Frequency: 16 dB

Effective attenuation at minimum frequency ensures proper signal filtering.

Package Material: PLASTIC

Plastic package material is lightweight and durable for long-term use.

Height: 0.8 mm

Low height allows for slim profile and flexible installation options.

Capacitance: 0.8 uF

Appropriate capacitance for effective filtering of data signals.

Technical Specifications

Data Line Filters SZEMI4193MTTAG attributes and parameters. Explore more Data Line Filters devices from Onsemi

Specs

Approvals (V):

IEC

Attenuation At Minimum Frequency:

16 dB

Capacitance:

.8 uF

Maximum DC Resistance:

Filter Type:

Height:

.8 mm

JESD-609 Code:

e3

Length:

4 mm

Mounting Type:

SURFACE MOUNT

No. of Functions:

6

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Impedance (ohm):

32 OHM

Package Material:

PLASTIC

Packing Method:

TR

Rated Current:

Terminal Finish:

TIN

Width (mm):

2.0

Trade Compliance

SZEMI4193MTTAG Filters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8504.50.80.00

SB

8504.50.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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