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SZ1SMA33CAT3G

Onsemi

SZ1SMA33CAT3G by Onsemi

SZ1SMA33CAT3G by Onsemi is a Zener diode with 33V peak reverse voltage, 400W power dissipation, and bidirectional polarity. It is used for transient suppression in automotive applications due to AEC-Q101 standard compliance.

Median Price

$0.312

Lifecycle Status

Suppliers In-Stock

28

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1k+

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Newark

USA . 5,000 parts In-Stock

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$0.110

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$0.110

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Farnell

UK . 4,556 parts In-Stock

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$0.352

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$0.259

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$0.233

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$0.220

4,556

$0.352

$0.259

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$0.220

Mouser Electronics

USA . 4,309 parts In-Stock

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$0.680

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$0.290

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$0.198

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$0.165

4,309

$0.680

$0.290

$0.198

$0.165

DigiKey

USA . 19,695 parts In-Stock

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$0.850

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$0.342

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$0.235

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$0.213

19,695

$0.850

$0.342

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$0.213

TTI Europe

Germany . 605,000 parts In-Stock

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Arrow

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Verical

USA . 175,000 parts In-Stock

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Chip1Stop

Japan . 40,000 parts In-Stock

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$0.312

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Flip Electronics (Authorized)

USA . 7,792 parts In-Stock

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Element14

Singapore . 4,556 parts In-Stock

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$0.475

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$0.430

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$0.407

4,556

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$0.475

$0.430

$0.407

Distributors (In-Stock)

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Digiode

USA . 664 parts In-Stock

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$0.232

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664

$0.232

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Maritex

Poland . 4,070 parts In-Stock

1+ parts

$0.772

100+ parts

$0.187

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$0.131

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$0.112

4,070

$0.772

$0.187

$0.131

$0.112

Bristol Electronics

USA . 20,000 parts In-Stock

1+ parts

$0.804

100+ parts

$0.402

1k+ parts

$0.161

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$0.101

20,000

$0.804

$0.402

$0.161

$0.101

Martec Srl

Italy . 302,076 parts In-Stock

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IBS Electronics

USA . 140,000 parts In-Stock

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$0.231

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Vyrian

USA . 123,724 parts In-Stock

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Chip Stock

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ComSIT Distribution GmbH

Germany . 30,000 parts In-Stock

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NAC Semi

USA . 25,000 parts In-Stock

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$0.334

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Dan-Mar Components

USA . 20,000 parts In-Stock

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DigiKey Marketplace

USA . 12,792 parts In-Stock

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Flip Electronics

USA . 7,792 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 5,000 parts In-Stock

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Diverse Electronics

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Q Components

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Classic Components Corporation

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LIBRA Elektronik GmbH

Germany . 76 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 341 parts In-Stock

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$0.048

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341

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Component Stockers USA

USA . 142,695 parts In-Stock

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$0.080

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$0.080

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$0.080

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$0.270

142,695

$0.080

$0.080

$0.080

$0.270

Semicontronic

India . 123,779 parts In-Stock

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$0.119

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$0.116

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$0.115

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123,779

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$0.115

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Ampacity Inc.

Singapore . 123,703 parts In-Stock

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$0.119

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Aztec Data Supply Inc.

USA . 4,967 parts In-Stock

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$0.194

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Corphita

USA . 1,803 parts In-Stock

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Kepictronics

USA . 66,540 parts In-Stock

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Perfect Parts

USA . 51,792 parts In-Stock

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Authorized Procurement Solutions

USA . 45,000 parts In-Stock

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Glotronic Ltd.

UK . 16,000 parts In-Stock

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Problanco Electronics

Mexico . 6,264 parts In-Stock

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SupplyDigital Components

Austria . 3,431 parts In-Stock

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Kulean Microsystems

USA . 2,927 parts In-Stock

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Continental Prestige Electronics

USA . 2,272 parts In-Stock

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$0.458

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$0.263

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TANS Electronics

Latvia . 1,606 parts In-Stock

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UHIMA Technologies

Türkiye . 673 parts In-Stock

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Argo Parts USA

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Bastille Electronics

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Formix International (Excess)

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Overview

Looking for reliable transient suppression devices? Look no further than the SZ1SMA33CAT3G by Onsemi. With a reputation for high-quality products, Onsemi delivers top-notch performance in the form of this Zener diode technology. Ideal for a variety of applications, this device offers protection against voltage spikes, ensuring the safety and longevity of your electronics. Trust Onsemi to provide superior quality and peace of mind with the SZ1SMA33CAT3G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides excellent durability and resistance to environmental factors, making this device reliable in various conditions.

Config: SINGLE

A single configuration allows for simplicity in circuit design and implementation, making it easy to integrate into electronic systems.

Surface Mount: YES

Being surface mount ensures a compact design, saving space on printed circuit boards and facilitating automation in assembly.

Maximum Non Repetitive Peak Reverse Power Dissipation: 400 W

This high power dissipation capability means the device can handle significant energy spikes, protecting sensitive components from damage.

Nominal Breakdown Voltage: 38.63 V

The nominal breakdown voltage is ideal for a wide range of applications, providing effective voltage clamping without unnecessarily triggering.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of board space and effective alignment with PCB traces during surface mounting.

Number of Terminals: 2

Having two terminals simplifies the connection process, making it easier to integrate within a circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package style results in a low profile, ideal for compact applications where space is at a premium.

Maximum Operating Temperature: 150 °C

Withstanding high temperatures ensures reliability and functionality in harsh operating environments.

Minimum Operating Temperature: -65 °C

The ability to function at very low temperatures expands application possibilities, especially in outdoor and extreme conditions.

Terminal Finish: TIN

Tin termination provides excellent solderability and corrosion resistance, enhancing long-term reliability of connections.

Terminal Position: DUAL

Dual terminal positioning helps in symmetrical mounting on the PCB, improving stability and electrical performance.

Maximum Power Dissipation: 0.5 W

The moderate power dissipation capability means it can operate effectively without overheating in typical conditions.

Minimum Breakdown Voltage: 36.7 V

A lower breakdown threshold allows for earlier clamping action, offering improved protection for sensitive circuits.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time ensures the device can be safely processed using standard soldering techniques without thermal damage.

Peak Reflow Temperature: 260 °C

The high reflow temperature allows compatibility with lead-free soldering processes, aligning with modern manufacturing practices.

Maximum Breakdown Voltage: 40.56 V

This maximum rating ensures that the device can withstand voltage spikes up to its breakdown voltage, enhancing circuit protection.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 signifies this device meets strict automotive standards, ensuring reliability in automotive applications.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

This type of diode provides enhanced protection against voltage transients, making it suitable for sensitive electronic components.

Technology: ZENER

Zener technology allows for precise voltage regulation and clamping, ensuring safety for downstream components.

Terminal Form: C BEND

The C bend terminal configuration aids in easier PCB assembly and improves mechanical stability once soldered.

Maximum Repetitive Peak Reverse Voltage: 33 V

This rating allows for safe operation under repetitive voltage spikes, providing robust protection in fluctuating environments.

Polarity: BIDIRECTIONAL

Bidirectional characteristics allow for protection from voltage transients in both polarities, enhancing the versatility of use.

Maximum Clamping Voltage: 53.3 V

A higher clamping voltage provides assurance that the protected circuit will be safe from harmful voltage levels during transient events.

Diode Element Material: SILICON

Silicon material is known for its excellent electrical properties, contributing to overall device performance and reliability.

Technical Specifications

Transient Suppression Devices SZ1SMA33CAT3G attributes and parameters. Explore more Transient Suppression Devices devices from Onsemi

Specs

Additional Features:

LOW ZENER IMPEDANCE, EXCELLENT CLAMPING CAPABILITY, HIGH RELIABILITY

Maximum Breakdown Voltage:

40.56 V

Minimum Breakdown Voltage:

36.7 V

Nominal Breakdown Voltage:

38.63 V

Maximum Clamping Voltage:

53.3 V

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

R-PDSO-C2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Reverse Power Dissipation:

400 W

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-65 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity:

BIDIRECTIONAL

Maximum Power Dissipation:

.5 W

Reference Standard:

AEC-Q101

Maximum Repetitive Peak Reverse Voltage:

33 V

Sub-Category:

Transient Suppressors

Surface Mount:

YES

Technology:

ZENER

Terminal Finish:

TIN

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

SZ1SMA33CAT3G Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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