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STK581U3C2D-E

Onsemi

STK581U3C2D-E by Onsemi

STK581U3C2D-E by Onsemi is a Motion Control IC with 18 terminals, operating voltage range of 0-450V. It offers max output current of 45A for AC motor control applications. The package style is flange mount with matte tin finish, making it suitable for high-voltage motion control systems.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 6,505 parts In-Stock

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Digiode

USA . 2,367 parts In-Stock

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$3.730

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$3.394

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$3.059

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AZTECH Wire

Italy . 712 parts In-Stock

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$17.230

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Vigor

Singapore . 2,500 parts In-Stock

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$19.600

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TANS Electronics

Latvia . 7,137 parts In-Stock

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Problanco Electronics

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Authorized Procurement Solutions

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Kulean Microsystems

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Corphita

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SupplyDigital Components

Austria . 1,321 parts In-Stock

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Perfect Parts

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UHIMA Technologies

Türkiye . 508 parts In-Stock

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Microchip USA

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Kepictronics

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Overview

Experience seamless and precise motion control with the STK581U3C2D-E by Onsemi. This top-of-the-line AC motor controller offers unparalleled quality and reliability, thanks to Onsemi's stellar reputation in the industry. Ideal for a wide range of applications, this motion control IC provides exceptional value and benefits to customers seeking efficient and effective solutions for their projects. Trust Onsemi to deliver cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular package shape typically offers more space for components and can aid in better heat dissipation, making it a good choice for a motion control IC.

Nominal Supply Voltage (Vsup): 280 V

With a high nominal supply voltage of 280V, this IC can handle higher power requirements, making it suitable for driving motors or other high-power applications.

No. of Terminals: 18

Having 18 terminals allows for more connectivity options and versatility in designing motion control systems using this IC.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides a secure and stable mounting option, making it ideal for applications where vibration or movement may be present.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides good solderability and conductivity, ensuring reliable connections for the IC in its application.

Terminal Position: SINGLE

Having a single terminal position simplifies the installation process and reduces the chances of wiring errors, making it user-friendly for designers.

Other IC type: AC MOTOR CONTROLLER

Being an AC motor controller IC, this product is specifically designed for controlling AC motors, offering specialized features and performance in motor control applications.

Minimum Supply Voltage (Vsup): 0 V

The ability to operate at a minimum supply voltage of 0V allows for flexibility in power requirements and can be useful in certain low-power applications.

Maximum Output Current: 45 A

With a high maximum output current of 45A, this IC can drive high-current loads such as motors or actuators, making it suitable for demanding motion control tasks.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides mechanical stability and easy soldering during assembly, ensuring robust connections for the IC in the circuit.

Maximum Supply Voltage (Vsup): 450 V

The high maximum supply voltage of 450V allows for compatibility with a wide range of power sources, making it versatile in various industrial or automotive applications.

Technical Specifications

Motion Control ICs STK581U3C2D-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-XSFM-T18

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

18

Maximum Output Current:

45 A

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Maximum Supply Voltage (Vsup):

450 V

Minimum Supply Voltage (Vsup):

0 V

Nominal Supply Voltage (Vsup):

280 V

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Trade Compliance

STK581U3C2D-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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