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STK57FU394AG-E

Onsemi

STK57FU394AG-E by Onsemi

STK57FU394AG-E by Onsemi is a Motion Control IC with 25 terminals, operating voltage range of 0-400V, and max output current of 30A. It is designed for AC motor control applications, featuring a rectangular package style suitable for flange mounting in temperatures ranging from -20 °C to 100°C.

Median Price

$10.930

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 6,111 parts In-Stock

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$10.930

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$9.780

10k+ parts

$9.210

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$9.780

$9.210

Verical

USA . 6,096 parts In-Stock

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$13.662

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$12.225

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$13.662

$12.225

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DigiKey

USA . 996 parts In-Stock

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$10.150

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$10.150

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Flip Electronics (Authorized)

USA . 996 parts In-Stock

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Digiode

USA . 645 parts In-Stock

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$11.571

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645

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Vyrian

USA . 6,917 parts In-Stock

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Flip Electronics

USA . 486 parts In-Stock

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Corohmni

South Africa . 438 parts In-Stock

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$10.150

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438

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Vigor

Singapore . 15,511 parts In-Stock

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$10.500

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Corphita

USA . 1,789 parts In-Stock

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$10.962

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Perfect Parts

USA . 26,247 parts In-Stock

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Kulean Microsystems

USA . 8,290 parts In-Stock

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Authorized Procurement Solutions

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Problanco Electronics

Mexico . 4,239 parts In-Stock

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SupplyDigital Components

Austria . 3,752 parts In-Stock

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TANS Electronics

Latvia . 3,691 parts In-Stock

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RC Electronics

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UHIMA Technologies

Türkiye . 947 parts In-Stock

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Kepictronics

USA . 500 parts In-Stock

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500

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Microchip USA

USA . 497 parts In-Stock

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497

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Overview

Upgrade your motion control systems with the STK57FU394AG-E by Onsemi. Known for their superior quality and reliability, Onsemi brings you a cutting-edge AC motor controller designed for maximum performance. Perfect for a wide range of applications, this rectangular package offers 25 terminals and a flange mount style for easy integration. With a supply voltage ranging from 0V to 400V and an impressive output current of 30A, this IC provides unmatched efficiency and precision. Elevate your projects with the STK57FU394AG-E and experience the difference Onsemi can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and reliability of the product, making it resistant to environmental factors.

Nominal Supply Voltage (Vsup): 280 V

The high nominal supply voltage of 280V allows for efficient and powerful operation of the motion control IC, making it suitable for a wide range of applications.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature of 100 °C ensures that the motion control IC can withstand harsh operating conditions without compromising performance.

Maximum Output Current: 30 A

The high maximum output current of 30A allows for handling of heavy loads and robust performance in motion control applications.

Technical Specifications

Motion Control ICs STK57FU394AG-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PZFM-T25

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-20 Cel

Maximum Output Current:

30 A

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

ZIP25/35H,.2,1.13FL

Package Shape:

Package Style (Meter):

FLANG MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Supply Voltage (Vsup):

400 V

Minimum Supply Voltage (Vsup):

0 V

Nominal Supply Voltage (Vsup):

280 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Position:

ZIG-ZAG

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

STK57FU394AG-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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