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SS30-TE-L-E

Onsemi

SS30-TE-L-E by Onsemi

SS30-TE-L-E by Onsemi is a Motion Control IC with 20 terminals, BICMOS technology, and 5V nominal voltage. Ideal for Brushless DC Motor control applications due to its low profile chip carrier package and quad terminal position. Operating temperature range from -30 °C to 95°C makes it versatile for various environments.

Median Price

$0.803

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 28,000 parts In-Stock

1+ parts

-

100+ parts

$0.774

1k+ parts

$0.643

10k+ parts

$0.573

28,000

-

$0.774

$0.643

$0.573

DigiKey

USA . 28,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.970

10k+ parts

-

28,000

-

-

$0.970

-

Verical

USA . 22,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.803

10k+ parts

$0.716

22,000

-

-

$0.803

$0.716

Distributors (In-Stock)

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Digiode

USA . 2,465 parts In-Stock

1+ parts

$0.597

100+ parts

-

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-

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-

2,465

$0.597

-

-

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Chip Stock

USA . 76,000 parts In-Stock

1+ parts

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76,000

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Vyrian

USA . 11,093 parts In-Stock

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11,093

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 423 parts In-Stock

1+ parts

$0.531

100+ parts

-

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-

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423

$0.531

-

-

-

Corphita

USA . 918 parts In-Stock

1+ parts

$0.565

100+ parts

-

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-

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-

918

$0.565

-

-

-

Advanced Electronics

New Zealand . 82 parts In-Stock

1+ parts

$6.456

100+ parts

$5.875

1k+ parts

$5.294

10k+ parts

-

82

$6.456

$5.875

$5.294

-

AZTECH Wire

Italy . 204 parts In-Stock

1+ parts

$18.240

100+ parts

-

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204

$18.240

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Continental Prestige Electronics

USA . 28,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.531

10k+ parts

-

28,000

-

-

$0.531

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

1+ parts

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20,000

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TANS Electronics

Latvia . 7,159 parts In-Stock

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7,159

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Kepictronics

USA . 5,982 parts In-Stock

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5,982

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Kulean Microsystems

USA . 3,445 parts In-Stock

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3,445

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Problanco Electronics

Mexico . 2,807 parts In-Stock

1+ parts

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2,807

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SupplyDigital Components

Austria . 2,286 parts In-Stock

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2,286

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Microchip USA

USA . 255 parts In-Stock

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255

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UHIMA Technologies

Türkiye . 168 parts In-Stock

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168

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Overview

Enhance your motion control applications with the SS30-TE-L-E by Onsemi, a cutting-edge Brushless DC Motor Controller that offers unparalleled quality and performance. Manufactured by industry-leader Onsemi, this chip carrier IC boasts a very thin profile and 20 terminals for seamless integration into your projects. With a wide supply voltage range of 2.2V to 6V and a maximum output current of 0.7A, this device provides exceptional value and reliability. Whether you're working on robotics, automation, or automotive systems, the SS30-TE-L-E delivers the precision and efficiency you need to excel in your field. Elevate your designs with the power of Onsemi's Motion Control ICs today.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, reducing assembly time and cost.

Nominal Supply Voltage (Vsup): 5 V

Compatible with commonly used power supply voltages, making integration into existing systems straightforward.

Maximum Operating Temperature: 95 °C

Can operate reliably in high temperature environments, increasing the versatility of the product.

Technology: BICMOS

Utilizes BiCMOS technology which combines the strengths of bipolar and CMOS technologies, providing high-speed operation and low-power consumption.

Maximum Output Current: 0.7 A

Capable of delivering a high output current, making it suitable for driving brushless DC motors with varying power requirements.

Technical Specifications

Motion Control ICs SS30-TE-L-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

S-XQCC-N20

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-30 Cel

Maximum Output Current:

.7 A

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC20,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

2.5 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

3 mm

Trade Compliance

SS30-TE-L-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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