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SBSS138LT3

Onsemi

SBSS138LT3 by Onsemi

SBSS138LT3 by Onsemi is a N-CHANNEL FET with 50V DS breakdown voltage, ideal for switching applications. It features a built-in diode, 3.5 ohm max RDS(on), and 0.2A max ID. This small outline transistor in gull wing package is designed for surface mount technology.

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SupplyDigital Components

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Corphita

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Overview

Enhance your electronic applications with the SBSS138LT3 by Onsemi, a top-quality Small Signal Field Effect Transistor (FET) designed for switching operations. Manufactured by industry leader Onsemi, this N-CHANNEL transistor boasts a single configuration with a built-in diode and operates in enhancement mode. With a maximum drain current of 0.2 A and a low drain-source on resistance of 3.5 ohms, this FET provides reliable performance for a wide range of electronic devices. Upgrade your projects with the SBSS138LT3 and experience the value and benefits it brings to your applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the transistor lightweight and durable, suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher electron mobility, providing faster switching speeds and better performance in high-frequency applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the transistor from reverse polarity and voltage spikes.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable performance in on/off circuits.

Surface Mount: YES

Being surface mountable allows for easy and compact integration onto circuit boards, saving space and facilitating mass production.

Minimum DS Breakdown Voltage: 50 V

With a minimum breakdown voltage of 50V, this transistor can handle higher voltages without getting damaged, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

Rectangular package shape provides stability during installation and ensures efficient heat dissipation for better performance and longevity.

Terminal Form: GULL WING

Gull wing terminals offer easy soldering and strong electrical connections, making the transistor suitable for automated assembly processes.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors provide better control over the switching operation and consume less power when in the off state, enhancing overall efficiency.

No. of Terminals: 3

Having 3 terminals allows for easy connection to other components in the circuit, enabling versatile use in various electronic designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves board space and makes the transistor suitable for compact electronic devices where size is critical.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology ensures high performance, low power consumption, and better thermal stability for reliable operation in diverse environments.

Transistor Element Material: SILICON

Silicon-based transistors offer excellent electronic properties, high reliability, and compatibility with existing manufacturing processes, ensuring a dependable and widely used component.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides corrosion resistance, easy soldering, and robust electrical connections, ensuring long-term reliability in various operating conditions.

Maximum Drain Current (ID): 0.2 A

Capable of handling a maximum drain current of 0.2A, this transistor can manage moderate power requirements in typical switching applications without overheating.

Maximum Drain-Source On Resistance: 3.5 ohm

With a low on-resistance of 3.5 ohms, this transistor minimizes power losses and heat dissipation, contributing to energy efficiency and reliable performance.

Terminal Position: DUAL

Dual terminal position enhances circuit flexibility and simplifies board layout, enabling easy integration into various electronic designs for optimized functionality.

Maximum Feedback Capacitance (Crss): 5 pF

Having a low feedback capacitance of 5pF reduces signal distortion, ensuring accurate signal processing and better overall performance in high-frequency applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) SBSS138LT3 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

50 V

Maximum Drain Current (ID):

.2 A

Maximum Drain-Source On Resistance:

3.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

5 pF

JEDEC-95 Code:

TO-236

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SBSS138LT3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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