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SA575DTB

Onsemi

SA575DTB by Onsemi

SA575DTB by Onsemi is an Analog Computational IC with 2 functions, operating at -40 to 85 °C. It has a supply voltage range of 3-7 V and bandwidth of 0.02 kHz. Ideal for industrial applications requiring compact design and low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 11,500 parts In-Stock

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Vyrian

USA . 5,605 parts In-Stock

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Digiode

USA . 110 parts In-Stock

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AZTECH Wire

Italy . 296 parts In-Stock

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$19.610

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RC Electronics

USA . 7,920 parts In-Stock

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$3.000

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$2.830

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$2.770

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$2.770

Vigor

Singapore . 6,109 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Problanco Electronics

Mexico . 3,654 parts In-Stock

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Kulean Microsystems

USA . 3,613 parts In-Stock

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TANS Electronics

Latvia . 1,435 parts In-Stock

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Corphita

USA . 794 parts In-Stock

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SupplyDigital Components

Austria . 555 parts In-Stock

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UHIMA Technologies

Türkiye . 491 parts In-Stock

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Microchip USA

USA . 399 parts In-Stock

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Corohmni

South Africa . 340 parts In-Stock

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Overview

Enhance your analog computational applications with the SA575DTB by Onsemi. Built with precision and reliability, Onsemi's reputation for quality shines through in this product. With a wide range of functions packed into a small, thin profile package, customers can expect superior performance and efficiency. Whether you're looking to improve signal processing or enhance audio systems, the SA575DTB offers value, benefits, and advantages that will elevate your projects to the next level. Choose Onsemi for excellence in analog computational technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the product, ensuring its longevity.

No. of Functions: 2

With multiple functions, this product offers versatility in its applications and can handle various computational tasks efficiently.

Nominal Supply Voltage (Vsup): 5 V

The nominal supply voltage of 5V makes this product compatible with a wide range of systems and power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and maintain performance under heat stress.

Nominal Bandwidth: 0.02 kHz

The nominal bandwidth of 0.02 kHz indicates that this product can process signals and data efficiently within the specified frequency range.

Technical Specifications

Analog Computational SA575DTB attributes and parameters. Explore more Analog Computational devices from Onsemi

Specs

Other IC type:

Nominal Bandwidth:

.02 kHz

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Positive Input Voltage:

7 V

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Analog Computational Functions

Maximum Supply Current (Isup):

5.5 mA

Maximum Supply Voltage (Vsup):

7 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

SA575DTB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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