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P2P2304NZF-08SR

Onsemi

P2P2304NZF-08SR by Onsemi

P2P2304NZF-08SR clock driver by Onsemi features 5ns propagation delay, 3.3V nominal voltage, and industrial temperature grade. Ideal for applications requiring precise timing control in compact designs with surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,359 parts In-Stock

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Vyrian

USA . 1,964 parts In-Stock

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SupplyDigital Components

Austria . 8,268 parts In-Stock

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Kulean Microsystems

USA . 8,199 parts In-Stock

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Problanco Electronics

Mexico . 3,256 parts In-Stock

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TANS Electronics

Latvia . 592 parts In-Stock

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Corphita

USA . 544 parts In-Stock

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Vigor

Singapore . 500 parts In-Stock

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Microchip USA

USA . 342 parts In-Stock

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Corohmni

South Africa . 309 parts In-Stock

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UHIMA Technologies

Türkiye . 178 parts In-Stock

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Overview

Elevate your clock signal performance with the P2P2304NZF-08SR by Onsemi. Crafted with precision and expertise, this Clock Driver & Buffer offers unparalleled quality and reliability for a wide range of applications. With a small outline package style and standard input conditioning, this product is designed to enhance efficiency and accuracy in your designs. Experience fast propagation delay of 5ns and industrial-grade temperature tolerance from -40 to 85 °C. Trust Onsemi to deliver cutting-edge technology that exceeds expectations, providing value and benefits that set you apart from the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures the durability and long-lasting performance of the product.

Surface Mount: YES

Facilitates easy installation and saves space on the PCB.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with standard supply voltage requirements, making it versatile for various applications.

Propagation Delay (tpd): 5 ns

Low propagation delay ensures fast signal processing and accurate timing.

Maximum Operating Temperature: 85 °C

Can operate efficiently in high-temperature environments.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme cold conditions as well.

Width: 3.9 mm

Compact size enables easy integration into designs with space constraints.

Terminal Pitch: 1.27 mm

Standard pitch size for easy PCB layout and soldering.

Technical Specifications

Clock Drivers & Buffers P2P2304NZF-08SR attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

2304

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

5 ns

Maximum Same Edge Skew (tskwd):

.1 ns

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

P2P2304NZF-08SR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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