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P2P2305NZG-08SR

Onsemi

P2P2305NZG-08SR by Onsemi

P2P2305NZG-08SR by Onsemi is a clock driver with 6ns propagation delay, 3.3V nominal voltage, and 8 terminals. It is used in applications requiring precise timing control and signal synchronization in commercial temperature environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,728 parts In-Stock

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Digiode

USA . 1,176 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 929 parts In-Stock

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$20.460

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929

$20.460

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$26.058

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$23.713

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$21.368

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$26.058

$23.713

$21.368

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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SupplyDigital Components

Austria . 6,126 parts In-Stock

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Kulean Microsystems

USA . 5,762 parts In-Stock

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TANS Electronics

Latvia . 2,577 parts In-Stock

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Corphita

USA . 1,080 parts In-Stock

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Problanco Electronics

Mexico . 564 parts In-Stock

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Microchip USA

USA . 439 parts In-Stock

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UHIMA Technologies

Türkiye . 142 parts In-Stock

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Corohmni

South Africa . 141 parts In-Stock

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Overview

Enhance your electronic projects with the P2P2305NZG-08SR Clock Driver & Buffer by Onsemi. Known for their superior quality and reliability, Onsemi delivers cutting-edge solutions for a wide range of applications. With its small outline package and low propagation delay, this clock driver offers seamless performance and precision timing. Experience the value of quick signal conditioning and optimal functionality with the P2P2305NZG-08SR, designed to meet the demands of modern electronics. Elevate your projects with Onsemi's innovative technology and unlock endless possibilities in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness, making the product reliable and affordable.

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly, saving time and simplifying the manufacturing process.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a common voltage level of 3.3V ensures compatibility with a wide range of systems and components.

Propagation Delay (tpd): 6 ns

With a low propagation delay of 6ns, this product offers fast signal processing, essential for high-speed applications.

Maximum Operating Temperature: 70 °C

The ability to operate at temperatures up to 70 °C ensures reliability in a variety of environmental conditions.

Terminal Finish: TIN

A TIN terminal finish provides good conductivity and solderability, ensuring a reliable electrical connection.

Width: 3.91 mm

The compact width of 3.91mm allows for high-density PCB designs, saving space in electronic devices.

Temperature Grade: COMMERCIAL

Designed for commercial applications, this product meets standard requirements for temperature range and performance.

Maximum Same Edge Skew (tskwd): 0.25 ns

Low skew ensures accurate synchronization of signals, critical for maintaining signal integrity in digital systems.

No. of True Outputs: 5

Having 5 true outputs provides flexibility in signal routing and distribution, suitable for various clocking and buffering applications.

Technical Specifications

Clock Drivers & Buffers P2P2305NZG-08SR attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

2305

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

5

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

6 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.25 ns

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.91 mm

Trade Compliance

P2P2305NZG-08SR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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