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P2P2304NZF-08TR

Onsemi

P2P2304NZF-08TR by Onsemi

P2P2304NZF-08TR clock driver by Onsemi features 5ns propagation delay, operates in industrial temperature range (-40 to 85 °C), and has 8 terminals with a 0.65mm pitch. It is suitable for applications requiring precise timing synchronization in compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 621 parts In-Stock

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Vyrian

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Component Stockers USA

USA . 794 parts In-Stock

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Problanco Electronics

Mexico . 6,239 parts In-Stock

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SupplyDigital Components

Austria . 2,843 parts In-Stock

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Corphita

USA . 648 parts In-Stock

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TANS Electronics

Latvia . 563 parts In-Stock

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Kulean Microsystems

USA . 508 parts In-Stock

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Vigor

Singapore . 400 parts In-Stock

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UHIMA Technologies

Türkiye . 241 parts In-Stock

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Corohmni

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Microchip USA

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Overview

Unlock the potential of your electronics with the P2P2304NZF-08TR clock driver & buffer by Onsemi. Crafted from high-quality materials and boasting a wide range of applications, this product is designed to enhance performance and reliability. With its compact size and efficient design, it offers customers unmatched value and benefits. Experience faster processing speeds and improved functionality with this innovative solution. Elevate your projects with Onsemi's trusted expertise and cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the package lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving space and making the product more versatile.

Input Conditioning: STANDARD

Ensures compatibility with various input signals and equipment, making integration seamless.

Nominal Supply Voltage / Vsup (V): 3.3

Works efficiently with a standard voltage supply, reducing the need for additional components or modifications.

Propagation Delay (tpd): 5 ns

Provides fast signal processing and response times, crucial for time-sensitive applications.

Maximum Operating Temperature: 85 °C

Capable of operating in high-temperature environments, enhancing the product's reliability and performance under stress.

Minimum Operating Temperature: -40 °C

Can function in extremely cold temperatures, making it suitable for a wide range of environmental conditions.

Width: 3 mm

Compact dimensions allow for efficient use of space on the PCB, especially in applications with limited real estate.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring long-term durability and reliability.

Maximum Same Edge Skew (tskwd): 0.1 ns

Provides precise and accurate signal timing, critical for maintaining synchronization in complex systems.

Technical Specifications

Clock Drivers & Buffers P2P2304NZF-08TR attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

2304

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.4 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

5 ns

Maximum Same Edge Skew (tskwd):

.1 ns

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

P2P2304NZF-08TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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