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NVJS3151PT1G

Onsemi

NVJS3151PT1G by Onsemi

NVJS3151PT1G by Onsemi is a P-CHANNEL FET with built-in diode and resistor, ideal for switching applications. It features a min DS breakdown voltage of 12V, max drain current of 2.7A, and max operating temp of 150 °C. With a small outline package style and matte tin terminal finish, it offers reliable performance in various electronic devices.

Median Price

$0.580

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3,000 parts In-Stock

1+ parts

$0.580

100+ parts

$0.228

1k+ parts

$0.154

10k+ parts

$0.113

3,000

$0.580

$0.228

$0.154

$0.113

Mouser Electronics

USA . 2,700 parts In-Stock

1+ parts

$0.580

100+ parts

$0.228

1k+ parts

$0.154

10k+ parts

$0.130

2,700

$0.580

$0.228

$0.154

$0.130

Rochester

USA . 2,800 parts In-Stock

1+ parts

-

100+ parts

$0.127

1k+ parts

$0.105

10k+ parts

$0.094

2,800

-

$0.127

$0.105

$0.094

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 63,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.170

10k+ parts

-

63,000

-

-

$0.170

-

Vyrian

USA . 7,896 parts In-Stock

1+ parts

-

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7,896

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Digiode

USA . 2,145 parts In-Stock

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2,145

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 60 parts In-Stock

1+ parts

$1.433

100+ parts

$1.304

1k+ parts

$1.175

10k+ parts

-

60

$1.433

$1.304

$1.175

-

AZTECH Wire

Italy . 709 parts In-Stock

1+ parts

$13.430

100+ parts

-

1k+ parts

-

10k+ parts

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709

$13.430

-

-

-

Kepictronics

USA . 99,000 parts In-Stock

1+ parts

-

100+ parts

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99,000

-

-

-

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Kulean Microsystems

USA . 4,903 parts In-Stock

1+ parts

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4,903

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-

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TANS Electronics

Latvia . 3,575 parts In-Stock

1+ parts

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100+ parts

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3,575

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SupplyDigital Components

Austria . 1,964 parts In-Stock

1+ parts

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1,964

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Problanco Electronics

Mexico . 1,185 parts In-Stock

1+ parts

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1,185

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UHIMA Technologies

Türkiye . 960 parts In-Stock

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960

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Corphita

USA . 416 parts In-Stock

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416

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Corohmni

South Africa . 65 parts In-Stock

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65

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Overview

Unlock the power of reliable switching with the NVJS3151PT1G by Onsemi. Crafted with precision and quality in mind, this P-Channel small signal field-effect transistor boasts a single configuration with a built-in diode and resistor for enhanced performance. Ideal for applications requiring efficient switching, this FET offers maximum power dissipation of 0.625W and a minimum DS breakdown voltage of 12V. With a temperature range of -55 to 150 °C, this versatile component is sure to deliver exceptional value and benefits to your projects. Enhance your designs with the trusted technology of Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good insulation and protection for the transistor, making it durable and reliable for long-term use.

Polarity or Channel Type: P-CHANNEL

P-channel transistors are known for their low on-resistance and high input impedance, making them suitable for low-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR

The built-in diode and resistor provide added functionality in the circuit design, reducing the need for external components and simplifying the overall design.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast switching speeds and efficient performance.

Surface Mount: YES

Surface mount technology allows for compact and space-saving designs, ideal for small signal applications where board space is limited.

Minimum DS Breakdown Voltage: 12 V

With a minimum breakdown voltage of 12V, this transistor can withstand higher voltages without breakdown, ensuring reliable operation under varying conditions.

Package Shape: RECTANGULAR

Rectangular package shape offers easy handling and installation on PCBs, making it convenient for assembly.

Terminal Form: GULL WING

Gull wing terminals provide good solderability and mechanical strength, ensuring secure connections on the PCB.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors have high input impedance and low leakage currents, offering improved efficiency and performance in the circuit.

No. of Terminals: 6

Having 6 terminals allows for versatile connections and applications in complex circuit designs.

Maximum Power Dissipation (Abs): 0.625 W

With a maximum power dissipation of 0.625W, this transistor can handle higher power levels while maintaining stable operation.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and enables densely packed designs in small signal applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high reliability and performance in the transistor, ensuring long-term stability in the circuit.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this transistor can withstand high temperatures, making it suitable for a wide range of applications.

Transistor Element Material: SILICON

Silicon material provides good electrical properties and performance, making it a common choice for transistors in electronic devices.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55 °C, this transistor can operate in cold environments without compromising performance.

Terminal Finish: MATTE TIN

Matte tin finish on terminals offers good solderability and corrosion resistance, ensuring reliable connections in the circuit.

Maximum Drain Current (ID): 2.7 A

With a maximum drain current of 2.7A, this transistor can handle higher current levels, making it suitable for applications that require high power output.

Maximum Drain-Source On Resistance: 0.06 ohm

Low drain-source on resistance of 0.06 ohm results in minimal power loss and improved efficiency in the circuit operation.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit connections and applications, allowing for versatile design options.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this transistor can be easily soldered onto the PCB during assembly.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260 °C ensures proper soldering of the transistor on the PCB, maintaining strong connections for reliable performance.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 standard ensures high quality and reliability of the transistor, making it suitable for automotive applications that require stringent quality standards.

Technical Specifications

Small Signal Field Effect Transistors (FET) NVJS3151PT1G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

12 V

Maximum Drain Current (ID):

2.7 A

Maximum Drain-Source On Resistance:

.06 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NVJS3151PT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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