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NVB5404NT4G

Onsemi

NVB5404NT4G by Onsemi

NVB5404NT4G by Onsemi is a N-CHANNEL FET with 40V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 670A IDM, 1000mJ EAS, and 0.0045 ohm RDS(on). Package: PLASTIC/EPOXY, GULL WING terminals, and operates up to 175°C. AEC-Q101 compliant for automotive use.

Median Price

$1.563

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 786 parts In-Stock

1+ parts

$3.960

100+ parts

$1.815

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786

$3.960

$1.815

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Rochester

USA . 492 parts In-Stock

1+ parts

-

100+ parts

$1.510

1k+ parts

$1.250

10k+ parts

$1.120

492

-

$1.510

$1.250

$1.120

Verical

USA . 492 parts In-Stock

1+ parts

-

100+ parts

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$1.563

10k+ parts

$1.400

492

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-

$1.563

$1.400

Distributors (In-Stock)

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Digiode

USA . 921 parts In-Stock

1+ parts

$1.282

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921

$1.282

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Chip Stock

USA . 57,000 parts In-Stock

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Vyrian

USA . 9,914 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 119 parts In-Stock

1+ parts

$1.215

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119

$1.215

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Corohmni

South Africa . 328 parts In-Stock

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$1.260

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328

$1.260

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Component Stockers USA

USA . 1,339 parts In-Stock

1+ parts

$1.380

100+ parts

$1.290

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1,339

$1.380

$1.290

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Perfect Parts

USA . 30,556 parts In-Stock

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30,556

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Kepictronics

USA . 13,000 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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SupplyDigital Components

Austria . 4,428 parts In-Stock

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Kulean Microsystems

USA . 4,018 parts In-Stock

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Problanco Electronics

Mexico . 2,989 parts In-Stock

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TANS Electronics

Latvia . 2,490 parts In-Stock

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2,490

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Continental Prestige Electronics

USA . 492 parts In-Stock

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$1.440

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492

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$1.440

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UHIMA Technologies

Türkiye . 183 parts In-Stock

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Overview

Experience the power of innovation with the NVB5404NT4G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their Power Field Effect Transistors (FET). Ideal for switching applications, this N-CHANNEL transistor boasts a single configuration with a built-in diode for added convenience. With a high DS breakdown voltage of 40V and a maximum pulsed drain current of 670A, this transistor offers exceptional performance and efficiency. Trust Onsemi to provide cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the NVB5404NT4G and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the FET, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower ON-resistance and higher current carrying capacity compared to P-channel FETs, making this product suitable for high power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for faster switching speeds and provides protection against voltage spikes, improving the overall performance of the FET.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast turn-on and turn-off times, making it efficient and reliable for switching circuits.

Surface Mount: YES

Being surface mountable, this FET can be easily mounted on PCBs, saving space and facilitating automated assembly processes.

Maximum Drain Current (ID): 24 A

With a high maximum drain current rating, this FET can handle high power loads with ease, making it suitable for demanding applications.

Maximum Power Dissipation (Abs): 254 W

The high power dissipation capability allows the FET to handle significant amounts of power without overheating, ensuring reliable operation under heavy loads.

Maximum Operating Temperature: 175 °C

With a high operating temperature range, this FET can operate effectively in various environmental conditions without the risk of thermal damage.

Technical Specifications

Power Field Effect Transistors (FET) NVB5404NT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1000 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

167 A

Maximum Drain Current (ID):

24 A

Maximum Drain-Source On Resistance:

.0045 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

670 A

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NVB5404NT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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