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NVB5405NT4G

Onsemi

NVB5405NT4G by Onsemi

NVB5405NT4G by Onsemi is a N-CHANNEL Power FET with 40V DS Breakdown Voltage and 280A IDM. Ideal for applications requiring high power dissipation, such as automotive electronics due to its AEC-Q101 reference standard compliance.

Median Price

$1.402

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,600 parts In-Stock

1+ parts

-

100+ parts

$1.220

1k+ parts

$1.090

10k+ parts

$1.020

5,600

-

$1.220

$1.090

$1.020

Avnet

USA . 5,600 parts In-Stock

1+ parts

-

100+ parts

$1.440

1k+ parts

$1.330

10k+ parts

$1.250

5,600

-

$1.440

$1.330

$1.250

DigiKey

USA . 5,600 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$1.600

10k+ parts

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5,600

-

-

$1.600

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Verical

USA . 5,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.363

10k+ parts

$1.275

5,600

-

-

$1.363

$1.275

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,007 parts In-Stock

1+ parts

$1.090

100+ parts

-

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2,007

$1.090

-

-

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Digiode

USA . 417 parts In-Stock

1+ parts

$1.282

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417

$1.282

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 241 parts In-Stock

1+ parts

$1.090

100+ parts

-

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241

$1.090

-

-

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Corphita

USA . 1,227 parts In-Stock

1+ parts

$1.215

100+ parts

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1,227

$1.215

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

1+ parts

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56,986

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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QUARKTWIN TECHNOLOGY LTD

USA . 10,538 parts In-Stock

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10,538

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Microchip USA

USA . 6,547 parts In-Stock

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6,547

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SupplyDigital Components

Austria . 6,280 parts In-Stock

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6,280

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Problanco Electronics

Mexico . 2,867 parts In-Stock

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2,867

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TANS Electronics

Latvia . 1,963 parts In-Stock

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1,963

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Kulean Microsystems

USA . 1,280 parts In-Stock

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1,280

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UHIMA Technologies

Türkiye . 501 parts In-Stock

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501

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Overview

Enhance your power management solutions with the NVB5405NT4G by Onsemi. Crafted with precision and reliability, this N-CHANNEL Power Field Effect Transistor (FET) boasts a single configuration with a built-in diode for seamless integration. Ideal for a variety of applications, this transistor offers a maximum drain current of 16.5 A and an ultra-low on resistance of 0.0058 ohm, ensuring optimal performance. Trust in Onsemi's expertise and elevate your projects with the unmatched quality and efficiency of the NVB5405NT4G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the FET.

Polarity or Channel Type: N-CHANNEL

N-channel configuration allows for efficient current flow and high performance in various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies the circuit design and protects the FET from reverse voltage.

Surface Mount: YES

Surface mount capability saves space on the PCB and enables easy assembly.

Minimum DS Breakdown Voltage: 40 V

High breakdown voltage ensures reliable operation under different voltage conditions.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for easy control and modulation of the FET's characteristics.

Maximum Pulsed Drain Current (IDM): 280 A

High pulsed drain current capability is suitable for applications requiring high power handling.

Avalanche Energy Rating (EAS): 800 mJ

High avalanche energy rating enhances the FET's ability to withstand voltage spikes and transient events.

Maximum Drain Current (Abs) (ID): 116 A

High drain current rating allows for efficient current handling and performance.

Maximum Power Dissipation (Abs): 150 W

High power dissipation capability ensures thermal stability and reliability under heavy loads.

Maximum Operating Temperature: 175 °C

Wide operating temperature range allows for operation in various environmental conditions.

Maximum Drain-Source On Resistance: 0.0058 ohm

Low on-resistance minimizes power loss and improves efficiency in the FET.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 standard ensures high quality and reliability for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NVB5405NT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

800 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

116 A

Maximum Drain Current (ID):

16.5 A

Maximum Drain-Source On Resistance:

.0058 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

280 A

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVB5405NT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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