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NUP1301ML3T1G

Onsemi

NUP1301ML3T1G by Onsemi

NUP1301ML3T1G by Onsemi is a Transient Suppression Device with 70V breakdown voltage, 0.715A output current, and avalanche technology. It is a unidirectional diode used for surge protection in electronic circuits. Operating temperature range from -65°C to 150°C makes it suitable for various applications.

Median Price

$0.078

Lifecycle Status

Suppliers In-Stock

31

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 8 parts In-Stock

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$0.020

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8

$0.020

$0.020

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$0.020

Mouser Electronics

USA . 21,327 parts In-Stock

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$0.430

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$0.159

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$0.104

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$0.088

21,327

$0.430

$0.159

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$0.088

DigiKey

USA . 185,629 parts In-Stock

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$0.440

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$0.171

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$0.114

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$0.080

185,629

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$0.080

Future Electronics

Canada . 27,000 parts In-Stock

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Verical

USA . 18,000 parts In-Stock

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Master Electronics

USA . 18,000 parts In-Stock

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$0.074

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Avnet

USA . 15,000 parts In-Stock

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Arrow

USA . 12,000 parts In-Stock

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$0.059

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Rochester

USA . 1,735 parts In-Stock

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$0.078

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$0.065

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$0.058

1,735

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$0.058

Chip1Stop

Japan . 102 parts In-Stock

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$0.064

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Digiode

USA . 2,155 parts In-Stock

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$0.061

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Nova Conductors

Japan . 200 parts In-Stock

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TME

Poland . 474 parts In-Stock

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$0.240

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$0.091

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$0.082

474

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$0.118

$0.091

$0.082

Bristol Electronics

USA . 1,205 parts In-Stock

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$0.338

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$0.169

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$0.068

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1,205

$0.338

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$0.068

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Component Electronics Inc.

Canada . 500 parts In-Stock

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$0.380

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$0.290

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$0.250

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500

$0.380

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$0.250

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IBS Electronics

USA . 213,000 parts In-Stock

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$0.086

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$0.086

NAC Semi

USA . 135,000 parts In-Stock

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Vyrian

USA . 23,194 parts In-Stock

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Velocity Electronics

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Cyclops Electronics Ltd

UK . 8,532 parts In-Stock

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Chip Stock

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Semi Source

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Goldney Electronics S.L.

Spain . 2,700 parts In-Stock

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Semtec, LLC

USA . 2,650 parts In-Stock

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Holdelec - ElecDif-Pro

France . 2,615 parts In-Stock

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ComSIT Distribution GmbH

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ACDS - Activité Composants Distribution Service

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Sensible Micro Corp

USA . 1,171 parts In-Stock

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Microfarads

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Lantek

USA . 762 parts In-Stock

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Prism Electronics

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260

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Distributors (Availability)

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Ampacity Inc.

Singapore . 19,717 parts In-Stock

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$0.017

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Component Stockers USA

USA . 224,983 parts In-Stock

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$0.060

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224,983

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$0.060

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$0.060

Corohmni

South Africa . 187 parts In-Stock

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Semicontronic

India . 19,890 parts In-Stock

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$0.037

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$0.036

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$0.036

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Corphita

USA . 1,879 parts In-Stock

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$0.058

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Aztec Data Supply Inc.

USA . 2,156 parts In-Stock

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$0.073

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Continental Prestige Electronics

USA . 5,159 parts In-Stock

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$0.097

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$0.095

5,159

$0.097

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Argo Parts USA

USA . 2,919 parts In-Stock

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$0.097

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$0.094

2,919

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Bastille Electronics

Australia . 300 parts In-Stock

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$0.107

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$0.102

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$0.097

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$0.095

300

$0.107

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$0.097

$0.095

Perfect Parts

USA . 1,080,458 parts In-Stock

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Kepictronics

USA . 444,000 parts In-Stock

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Authorized Procurement Solutions

USA . 213,094 parts In-Stock

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GreenTree Electronics

Israel . 188,884 parts In-Stock

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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SupplyDigital Components

Austria . 7,275 parts In-Stock

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TANS Electronics

Latvia . 6,736 parts In-Stock

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Glotronic Ltd.

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Infinite Electronics LLP (Excess)

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Kulean Microsystems

USA . 4,181 parts In-Stock

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Problanco Electronics

Mexico . 3,608 parts In-Stock

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Formix International (Excess)

India . 2,155 parts In-Stock

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Futuretech Components

Singapore . 500 parts In-Stock

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UHIMA Technologies

Türkiye . 406 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 394 parts In-Stock

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Overview

Discover the NUP1301ML3T1G by Onsemi, a top-quality transient suppression device that offers unparalleled protection for your electronic circuits. Manufactured by Onsemi, a trusted name in the industry, this product is designed with precision and expertise to ensure reliability and performance. Ideal for a wide range of applications, this series connected, center tap device with 2 elements provides superior protection against voltage spikes and surges. With a maximum breakdown voltage of 70V and a maximum output current of 0.715A, this diode is sure to safeguard your equipment effectively. Trust Onsemi's NUP1301ML3T1G for peace of mind and quality assurance in your electronics projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the transient suppression device, ensuring long-lasting performance in various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving time and effort in the assembly process.

Minimum Operating Temperature: -65 °C

Wide operating temperature range enables the device to function effectively even in extreme cold conditions, making it versatile for different applications.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance of 260°C ensures reliable soldering during manufacturing processes, reducing the risk of damage to the device.

Maximum Repetitive Peak Reverse Voltage: 70 V

The high maximum repetitive peak reverse voltage rating of 70V offers robust protection against voltage spikes and surges, safeguarding sensitive circuitry.

Technical Specifications

Transient Suppression Devices NUP1301ML3T1G attributes and parameters. Explore more Transient Suppression Devices devices from Onsemi

Specs

Minimum Breakdown Voltage:

70 V

Config:

SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

Diode Element Material:

SILICON

Maximum Forward Voltage (VF):

.715 V

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Forward Current:

.5 A

No. of Elements:

2

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-65 Cel

Maximum Output Current:

.715 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity:

UNIDIRECTIONAL

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

70 V

Sub-Category:

Rectifier Diodes

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

NUP1301ML3T1G Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

NSN

5961-01-578-1537, 5961015781537

NIIN

015781537

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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