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NTMD3P03R2G

Onsemi

NTMD3P03R2G by Onsemi

NTMD3P03R2G by Onsemi is a P-CHANNEL FET with 30V DS breakdown voltage, ideal for switching applications. It features separate configuration with built-in diode, 2.34A max drain current, and 0.085 ohm max on resistance. With a small outline package style and matte tin terminal finish, it operates in enhancement mode up to 150°C.

Median Price

$0.526

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 141 parts In-Stock

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$0.247

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$0.232

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141

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Chip1Stop

Japan . 350 parts In-Stock

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$0.633

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$0.456

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$0.400

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350

$0.633

$0.456

$0.400

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Newark

USA . 694 parts In-Stock

1+ parts

$1.610

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$0.676

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$0.484

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694

$1.610

$0.676

$0.484

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Mouser Electronics

USA . 1,350 parts In-Stock

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$1.670

100+ parts

$0.703

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$0.504

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$0.425

1,350

$1.670

$0.703

$0.504

$0.425

Flip Electronics (Authorized)

USA . 5,000 parts In-Stock

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DigiKey

USA . 3,000 parts In-Stock

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$0.115

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$0.115

Verical

USA . 1,500 parts In-Stock

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$0.524

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$0.524

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Rochester

USA . 1,500 parts In-Stock

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$0.505

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$0.419

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$0.373

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$0.505

$0.419

$0.373

Farnell

UK . 1,244 parts In-Stock

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$0.528

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$0.434

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1,244

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$0.528

$0.434

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Distributors (In-Stock)

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Digiode

USA . 948 parts In-Stock

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$0.447

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948

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Nova Conductors

Japan . 10 parts In-Stock

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$0.721

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Chip Stock

USA . 44,000 parts In-Stock

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USA . 5,000 parts In-Stock

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Vyrian

USA . 1,806 parts In-Stock

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Speed Components Ltd

Israel . 765 parts In-Stock

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ComSIT Distribution GmbH

Germany . 600 parts In-Stock

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Bristol Electronics

USA . 317 parts In-Stock

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Sea View Technologies

USA . 225 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,961 parts In-Stock

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$0.400

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$0.400

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Semicontronic

India . 1,931 parts In-Stock

1+ parts

$0.400

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$0.390

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$0.388

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1,931

$0.400

$0.390

$0.388

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Corphita

USA . 1,773 parts In-Stock

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$0.424

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Corohmni

South Africa . 349 parts In-Stock

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$0.424

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349

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Benley Electronics

USA . 23 parts In-Stock

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$0.450

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23

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$0.707

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$0.678

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2,000

$0.707

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$0.678

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Argo Parts USA

USA . 1,214 parts In-Stock

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$0.721

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Advanced Electronics

New Zealand . 68 parts In-Stock

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$0.735

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$0.735

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$0.735

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68

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Aztec Data Supply Inc.

USA . 384 parts In-Stock

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$0.930

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iodParts Technologies Inc.

India . 79,999 parts In-Stock

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Perfect Parts

USA . 49,457 parts In-Stock

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Lixinc

USA . 19,441 parts In-Stock

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Kulean Microsystems

USA . 7,821 parts In-Stock

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Problanco Electronics

Mexico . 3,284 parts In-Stock

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Kepictronics

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Formix International (Excess)

India . 2,446 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,400 parts In-Stock

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Assy Fe

Spain . 2,160 parts In-Stock

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Continental Prestige Electronics

USA . 1,274 parts In-Stock

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$0.533

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$0.358

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SupplyDigital Components

Austria . 1,204 parts In-Stock

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TANS Electronics

Latvia . 873 parts In-Stock

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Futuretech Components

Singapore . 507 parts In-Stock

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UHIMA Technologies

Türkiye . 330 parts In-Stock

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ChipTracer

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Overview

Discover the NTMD3P03R2G by Onsemi, a high-quality P-channel small signal FET designed for switching applications. With a durable plastic/epoxy package and built-in diode, this transistor offers reliable performance and efficiency. Perfect for enhancing your electronic projects, this component features a low drain-source on resistance and maximum power dissipation of 0.73W to ensure optimal functionality. Trust in Onsemi's expertise and innovation to deliver exceptional value and benefits with the NTMD3P03R2G. Elevate your designs with this top-of-the-line transistor today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and durability, making the transistor suitable for a variety of environments.

Polarity or Channel Type: P-CHANNEL

P-channel transistors are efficient for certain applications and can help in reducing power consumption.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

Having separate elements with a built-in diode allows for more versatile circuit designs and protection against reverse current flow.

Transistor Application: SWITCHING

Designed for switching applications, this transistor offers fast response times and efficient power handling capabilities.

Surface Mount: YES

Surface mount capability makes it easy to integrate this transistor into compact circuit designs.

Minimum DS Breakdown Voltage: 30 V

With a high breakdown voltage, this transistor can handle higher voltages without failure.

Maximum Drain Current (Abs) (ID): 2.34 A

High maximum drain current means this transistor can handle higher power loads effectively.

Maximum Power Dissipation (Abs): 0.73 W

Low power dissipation helps in reducing energy waste and improving efficiency.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this transistor can be used in various industrial and automotive applications.

Maximum Drain-Source On Resistance: 0.085 ohm

Low on-resistance leads to less power loss and improved efficiency in switching applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTMD3P03R2G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

AVALANCHE RATED

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

2.34 A

Maximum Drain Current (ID):

2.34 A

Maximum Drain-Source On Resistance:

.085 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

135 pF

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMD3P03R2G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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