Loading...

NSTR4501NT1G

Onsemi

NSTR4501NT1G by Onsemi

NSTR4501NT1G by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features a 20V DS Breakdown Voltage, 10A Max Pulsed Drain Current, and 0.08 ohm Max Drain-Source Resistance. Ideal for use in automotive electronics due to AEC-Q101 compliance and high operating temperature of 150 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 75,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

75,000

-

-

-

-

Vyrian

USA . 6,185 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,185

-

-

-

-

Digiode

USA . 2,340 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,340

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 719 parts In-Stock

1+ parts

$13.480

100+ parts

-

1k+ parts

-

10k+ parts

-

719

$13.480

-

-

-

A-Z Elektronik GmbH

Germany . 7,202 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,202

-

-

-

-

Problanco Electronics

Mexico . 6,977 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,977

-

-

-

-

TANS Electronics

Latvia . 5,039 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,039

-

-

-

-

Kepictronics

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

SupplyDigital Components

Austria . 2,512 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,512

-

-

-

-

Corphita

USA . 672 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

672

-

-

-

-

Kulean Microsystems

USA . 572 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

572

-

-

-

-

Corohmni

South Africa . 429 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

429

-

-

-

-

UHIMA Technologies

Türkiye . 251 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

251

-

-

-

-

Overview

Unleash the power of innovation with the NSTR4501NT1G by Onsemi. Crafted with precision and quality, this Power Field Effect Transistor (FET) offers a seamless switching experience ideal for a range of applications. With a focus on enhancement mode operation and a maximum operating temperature of 150 °C, this transistor is designed to deliver optimal performance and reliability. Trust in Onsemi's expertise and elevate your projects with the versatility and efficiency of the NSTR4501NT1G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and reliability of the transistor.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have better performance and efficiency compared to P-channel transistors, making this product a good choice for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the transistor from voltage spikes, enhancing the overall performance and reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast switching speeds and low power consumption.

Surface Mount: YES

The surface mount capability makes this transistor suitable for compact electronic designs and automated assembly processes.

Minimum DS Breakdown Voltage: 20 V

The minimum breakdown voltage of 20V ensures safe operation within specified voltage limits.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient PCB layout and space-saving integration.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and ease of soldering during assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer improved performance characteristics such as lower on-state resistance and higher switching speed, making this product ideal for various applications.

Maximum Pulsed Drain Current (IDM): 10 A

With a high maximum pulsed drain current, this transistor can handle short-duration peak loads without risk of damaging the device.

Maximum Drain Current (Abs) (ID): 3.2 A

The maximum drain current rating of 3.2A ensures reliable operation under normal operating conditions.

No. of Terminals: 3

The 3 terminal configuration simplifies circuit connections and enhances overall reliability.

Maximum Power Dissipation (Abs): 1.25 W

The maximum power dissipation rating of 1.25W allows the transistor to handle high-power applications without overheating.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables compact and space-efficient electronic designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology ensures low power consumption, high performance, and reliability in various applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150 °C allows the transistor to withstand elevated temperatures without performance degradation.

Transistor Element Material: SILICON

Silicon-based transistor elements offer superior performance, reliability, and longevity compared to other materials.

Terminal Finish: TIN

The tin terminal finish provides good solderability and corrosion resistance, ensuring long-term reliability in various environments.

Maximum Drain Current (ID): 3.2 A

With a maximum drain current of 3.2A, this transistor can handle moderate power loads with ease.

Maximum Drain-Source On Resistance: 0.08 ohm

The low drain-source on-resistance of 0.08 ohms reduces power losses and improves efficiency in switching applications.

Terminal Position: DUAL

The dual terminal position allows for flexible mounting options and facilitates easy connection to external circuits.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time allowed at peak reflow temperature of 260 °C ensures proper soldering and reliability during assembly processes.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C enables high-temperature soldering processes without damaging the transistor.

Reference Standard: AEC-Q101

Compliance with the AEC-Q101 standard ensures that the transistor meets the stringent quality and reliability requirements for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NSTR4501NT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

3.2 A

Maximum Drain Current (ID):

3.2 A

Maximum Drain-Source On Resistance:

.08 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

10 A

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NSTR4501NT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.