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NSR2030DMXTAG

Onsemi

NSR2030DMXTAG by Onsemi

NSR2030DMXTAG by Onsemi is a fast recovery rectifier diode with 2 elements in a chip carrier package. It has a max reverse recovery time of 0.025 us, max forward voltage of 0.65 V, and can handle up to 2 A of output current. Ideal for applications requiring high-speed switching and low power dissipation.

Median Price

$0.398

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$0.383

1k+ parts

$0.318

10k+ parts

$0.283

3,000

-

$0.383

$0.318

$0.283

DigiKey

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.480

10k+ parts

-

3,000

-

-

$0.480

-

Verical

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.398

10k+ parts

$0.354

3,000

-

-

$0.398

$0.354

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 224 parts In-Stock

1+ parts

$0.298

100+ parts

-

1k+ parts

-

10k+ parts

-

224

$0.298

-

-

-

Vyrian

USA . 1,023 parts In-Stock

1+ parts

$0.314

100+ parts

-

1k+ parts

-

10k+ parts

-

1,023

$0.314

-

-

-

DigiKey Marketplace

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$0.330

1k+ parts

-

10k+ parts

-

3,000

-

$0.330

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,956 parts In-Stock

1+ parts

$0.283

100+ parts

-

1k+ parts

-

10k+ parts

-

1,956

$0.283

-

-

-

Corohmni

South Africa . 215 parts In-Stock

1+ parts

$0.314

100+ parts

-

1k+ parts

-

10k+ parts

-

215

$0.314

-

-

-

Problanco Electronics

Mexico . 6,034 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,034

-

-

-

-

Kulean Microsystems

USA . 3,304 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,304

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-

-

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SupplyDigital Components

Austria . 2,870 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,870

-

-

-

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TANS Electronics

Latvia . 1,756 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,756

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-

-

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Infinite Electronics LLP (Excess)

. 1,005 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,005

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-

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Formix International (Excess)

India . 1,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,000

-

-

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UHIMA Technologies

Türkiye . 590 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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590

-

-

-

-

Overview

Discover the NSR2030DMXTAG by Onsemi, a top-of-the-line diode & rectifier that delivers unmatched quality and reliability. With a fast recovery application, this product is designed for high-performance electronic systems. Onsemi, known for their exceptional manufacturing standards, ensures that customers receive a product that exceeds expectations in terms of efficiency and durability. Whether you're working on a consumer electronics project or industrial application, the NSR2030DMXTAG offers unparalleled value with its superior performance and cutting-edge technology. Upgrade your designs today with Onsemi's premium diode & rectifier!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package provides a durable and reliable housing for the diodes, ensuring long-term performance and protection against environmental factors.

Config: SEPARATE, 2 ELEMENTS

Having separate elements allows for better control and efficiency in the circuit, improving overall performance.

Surface Mount: YES

Surface mount technology enables easy installation and saves space, making it suitable for compact electronic devices.

Maximum Reverse Recovery Time: 0.025 us

The short reverse recovery time ensures fast switching speed, reducing power losses and improving efficiency.

Maximum Reverse Current: 20 uA

The low reverse current helps in minimizing leakage and improving the overall performance of the diodes.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into circuit boards and provides a stable mounting surface.

Reverse Test Voltage: 30 V

The high reverse test voltage rating ensures reliable operation and protection against voltage spikes.

No. of Terminals: 4

Having 4 terminals provides flexibility in wiring connections and allows for versatile use in different circuit configurations.

Package Style (Meter): CHIP CARRIER

The chip carrier package style is compact and ideal for high-density applications, saving space on the circuit board.

Application: FAST RECOVERY

Designed for fast recovery, making it suitable for high-frequency applications where rapid switching is required.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows for reliable operation in a wide range of environments.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy mounting and installation on the circuit board.

Case Connection: CATHODE

The cathode case connection provides a clear polarity indication for correct orientation during installation.

Maximum Power Dissipation: 0.634 W

The high power dissipation rating allows for efficient heat dissipation and ensures reliable operation under high loads.

Minimum Breakdown Voltage: 30 V

The high minimum breakdown voltage provides a safety margin against voltage surges and ensures protection for the circuit.

Diode Type: RECTIFIER DIODE

Being a rectifier diode, it is designed for converting AC to DC, making it suitable for various power supply applications.

Maximum Forward Voltage (VF): 0.65 V

The low forward voltage drop results in minimal power losses and efficient energy conversion.

Maximum Output Current: 2 A

Capable of handling high output currents, making it suitable for power supply and high-current applications.

Technology: SCHOTTKY

Utilizing Schottky technology provides low forward voltage drop and fast switching speed, improving efficiency and performance.

Terminal Form: NO LEAD

The no-lead terminal form allows for direct soldering onto the circuit board, simplifying the assembly process.

No. of Elements: 2

Having two elements offers redundancy and improved performance in the circuit.

Maximum Repetitive Peak Reverse Voltage: 30 V

The high maximum repetitive peak reverse voltage rating ensures reliability and protection against voltage spikes.

Maximum Non Repetitive Peak Forward Current: 55 A

Capable of handling high non-repetitive peak forward currents, making it suitable for applications with transient overloads.

Diode Element Material: SILICON

Utilizing silicon as the diode element material provides high efficiency and durability for long-lasting performance.

Technical Specifications

Diodes & Rectifiers NSR2030DMXTAG attributes and parameters. Explore more Diodes & Rectifiers devices from Onsemi

Specs

Application:

FAST RECOVERY

Minimum Breakdown Voltage:

30 V

Case Connection:

CATHODE

Config:

SEPARATE, 2 ELEMENTS

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

.65 V

JESD-30 Code:

R-PBCC-N4

Maximum Non Repetitive Peak Forward Current:

55 A

No. of Elements:

2

No. of Phases:

1

No. of Terminals:

4

Maximum Operating Temperature:

150 Cel

Maximum Output Current:

2 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Dissipation:

.634 W

Maximum Repetitive Peak Reverse Voltage:

30 V

Maximum Reverse Current:

20 uA

Maximum Reverse Recovery Time:

.025 us

Reverse Test Voltage:

30 V

Surface Mount:

YES

Technology:

SCHOTTKY

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

NSR2030DMXTAG Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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