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NP1300SCMCT3G

Onsemi

NP1300SCMCT3G by Onsemi

NP1300SCMCT3G by Onsemi is a silicon surge protector with a non-repetitive peak on-state current of 30A. It features a max DC off-state voltage of 120V and operates b/w -55 °C to 150°C. Ideal for applications requiring protection against surges, it is a UL recognized thyristor surge protector suitable for surface mount configurations.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,311 parts In-Stock

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Digiode

USA . 1,802 parts In-Stock

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AZTECH Wire

Italy . 498 parts In-Stock

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$11.560

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Kepictronics

USA . 120,000 parts In-Stock

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Metaverse IC Inc.

Canada . 120,000 parts In-Stock

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TANS Electronics

Latvia . 8,397 parts In-Stock

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Kulean Microsystems

USA . 4,351 parts In-Stock

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SupplyDigital Components

Austria . 2,745 parts In-Stock

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Corphita

USA . 2,411 parts In-Stock

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UHIMA Technologies

Türkiye . 872 parts In-Stock

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Problanco Electronics

Mexico . 817 parts In-Stock

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Corohmni

South Africa . 147 parts In-Stock

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Overview

Protect your valuable electronics with the NP1300SCMCT3G by Onsemi, a top-quality silicon surge protector designed to safeguard against power surges and voltage spikes. With a reliable manufacturer like Onsemi, you can trust that this device offers superior protection for your devices. Ideal for a wide range of applications, this surge protector is a must-have for any home or office setup. Don't compromise on the safety of your electronics - invest in the NP1300SCMCT3G for peace of mind and uninterrupted performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package body provides a durable and protective casing for the surge protector, ensuring longevity and reliability.

Configuration: SINGLE

Having a single configuration simplifies the installation process and makes it easier to integrate into various systems.

Non Repetitive Peak On-state Current: 30 A

A high non-repetitive peak on-state current capacity of 30A allows the surge protector to handle high levels of current safely, protecting connected devices effectively.

Surface Mount: YES

The ability to surface mount the surge protector makes it convenient for use in compact spaces and on PCBs.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a compact and space-efficient design for easy integration into different applications.

Terminal Form: C BEND

The C bend terminal form allows for easy and secure connection during installation, ensuring a reliable electrical connection.

No. of Terminals: 2

Having 2 terminals simplifies the connection process and makes it compatible with a wide range of systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style makes the surge protector suitable for applications where space is limited, without compromising on performance.

Maximum DC Off-state Voltage: 120 V

The maximum DC off-state voltage of 120V provides reliable protection against voltage spikes and surges within this range.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this surge protector can withstand high temperatures and perform reliably in demanding environments.

Trigger Device Type: THYRISTOR SURGE PROTECTOR

The thyristor surge protector type ensures fast and effective response to surges, offering reliable protection to connected devices.

Minimum Operating Temperature: -55 °C

The surge protector can operate in temperatures as low as -55 °C, making it suitable for use in a wide range of environments.

Terminal Finish: TIN

The tin terminal finish provides excellent conductivity and corrosion resistance, ensuring a reliable electrical connection.

Terminal Position: DUAL

Having dual terminal positions allows for flexibility in installation and compatibility with different types of connection setups.

Maximum Breakdown Voltage: 160 V

The surge protector has a maximum breakdown voltage of 160V, offering robust protection against voltage surges above this level.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds at peak temperature, the surge protector can withstand the soldering process without compromising its performance.

Peak Reflow Temperature °C: 260

The surge protector can handle a peak reflow temperature of 260 °C, ensuring stability and reliability during the soldering process.

Reference Standard: UL RECOGNIZED

Being UL recognized ensures that the surge protector meets industry safety and quality standards, providing peace of mind for users.

Technical Specifications

Silicon Surge Protectors NP1300SCMCT3G attributes and parameters. Explore more Silicon Surge Protectors devices from Onsemi

Specs

Maximum Breakdown Voltage:

160 V

Configuration:

Maximum DC Off-state Voltage:

120 V

JEDEC-95 Code:

DO-214AA

JESD-30 Code:

R-PDSO-C2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Non Repetitive Peak On-state Current:

30 A

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Sub-Category:

Silicon Surge Protectors

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

C BEND

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Device Type:

Trade Compliance

NP1300SCMCT3G Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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