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NP0640SAT3G

Onsemi

NP0640SAT3G by Onsemi

NP0640SAT3G by Onsemi is a silicon surge protector with a max DC off-state voltage of 58V and trigger device type as thyristor. It has a max operating temperature of 150 °C, making it suitable for applications requiring protection against voltage surges. With UL recognition, this device is ideal for surface mount configurations in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,039 parts In-Stock

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4,039

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J2 Sourcing AB

Sweden . 2,500 parts In-Stock

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2,500

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Digiode

USA . 823 parts In-Stock

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823

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Prism Electronics

USA . 100 parts In-Stock

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100

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Distributors (Availability)

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Ampacity Inc.

Singapore . 930 parts In-Stock

1+ parts

$5.100

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930

$5.100

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AZTECH Wire

Italy . 126 parts In-Stock

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$9.390

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126

$9.390

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Kepictronics

USA . 120,000 parts In-Stock

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120,000

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Problanco Electronics

Mexico . 5,596 parts In-Stock

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5,596

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SupplyDigital Components

Austria . 4,491 parts In-Stock

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4,491

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Kulean Microsystems

USA . 1,516 parts In-Stock

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1,516

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UHIMA Technologies

Türkiye . 970 parts In-Stock

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970

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TANS Electronics

Latvia . 353 parts In-Stock

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353

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Corohmni

South Africa . 298 parts In-Stock

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298

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Corphita

USA . 273 parts In-Stock

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273

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Overview

Protect your valuable electronic devices with the NP0640SAT3G silicon surge protector by Onsemi. As a trusted manufacturer in the industry, Onsemi ensures top-quality products that provide reliable protection against power surges. Ideal for a wide range of applications, this single configuration device offers peace of mind with its high maximum breakdown voltage and UL recognized reference standard. With a compact package style and dual terminal position, the NP0640SAT3G is easy to install and offers maximum protection, making it a must-have for any electronic setup. Upgrade your surge protection today with Onsemi's NP0640SAT3G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and resistance against external elements, making it a reliable choice for surge protection.

Configuration: SINGLE

The single configuration makes installation and replacement simpler, reducing complexity in set-up and maintenance of surge protection systems.

Surface Mount: YES

Being surface mountable allows for easy integration into existing circuit boards, making it a convenient choice for electronics manufacturers.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature ensures reliable operation even in challenging environmental conditions, providing a dependable surge protection solution.

Trigger Device Type: THYRISTOR SURGE PROTECTOR

The use of thyristor surge protector as the trigger device offers fast and effective protection against power surges, safeguarding connected equipment and devices.

Technical Specifications

Silicon Surge Protectors NP0640SAT3G attributes and parameters. Explore more Silicon Surge Protectors devices from Onsemi

Specs

Maximum Breakdown Voltage:

77 V

Configuration:

Maximum DC Off-state Voltage:

58 V

Maximum Holding Current:

150 mA

JEDEC-95 Code:

DO-214AA

JESD-30 Code:

R-PDSO-C2

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Sub-Category:

Silicon Surge Protectors

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

C BEND

Terminal Position:

Trigger Device Type:

Trade Compliance

NP0640SAT3G Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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