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NLVHC1G66MUR2G

Onsemi

NLVHC1G66MUR2G by Onsemi

NLVHC1G66MUR2G by Onsemi is a SPST switch with 60 ohm Ron, 50 ns switch-on/off time, and 80 dB isolation. It operates in a temperature range of -55 to 125 °C and is suitable for military-grade applications requiring a compact design with dual terminals.

Median Price

$0.073

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 117,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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$0.066

117,000

-

-

-

$0.066

Rochester

USA . 87,000 parts In-Stock

1+ parts

-

100+ parts

$0.079

1k+ parts

$0.066

10k+ parts

$0.059

87,000

-

$0.079

$0.066

$0.059

Verical

USA . 48,000 parts In-Stock

1+ parts

-

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-

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$0.073

48,000

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-

$0.073

Distributors (In-Stock)

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Nova Conductors

Japan . 19 parts In-Stock

1+ parts

$0.058

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19

$0.058

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Digiode

USA . 1,427 parts In-Stock

1+ parts

$0.062

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1,427

$0.062

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Vyrian

USA . 4,745 parts In-Stock

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4,745

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Distributors (Availability)

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Ampacity Inc.

Singapore . 101,631 parts In-Stock

1+ parts

$0.055

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101,631

$0.055

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Corohmni

South Africa . 404 parts In-Stock

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$0.057

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404

$0.057

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Argo Parts USA

USA . 2,826 parts In-Stock

1+ parts

$0.058

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-

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$0.056

2,826

$0.058

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$0.056

Netroflash

USA . 500 parts In-Stock

1+ parts

$0.058

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500

$0.058

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Corphita

USA . 956 parts In-Stock

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$0.058

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956

$0.058

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Vigor

Singapore . 406 parts In-Stock

1+ parts

$0.060

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406

$0.060

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AZTECH Wire

Italy . 610 parts In-Stock

1+ parts

$15.350

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610

$15.350

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Continental Prestige Electronics

USA . 87,000 parts In-Stock

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$0.056

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87,000

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$0.056

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Problanco Electronics

Mexico . 6,551 parts In-Stock

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6,551

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Kulean Microsystems

USA . 5,230 parts In-Stock

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TANS Electronics

Latvia . 4,483 parts In-Stock

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4,483

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SupplyDigital Components

Austria . 3,139 parts In-Stock

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UHIMA Technologies

Türkiye . 504 parts In-Stock

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504

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Microchip USA

USA . 166 parts In-Stock

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166

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Overview

Enhance your electronic designs with the NLVHC1G66MUR2G multiplexer from Onsemi. With a durable plastic/epoxy body and small outline package, this versatile component is perfect for a variety of applications. Whether you're working on military-grade equipment or consumer electronics, this switch delivers exceptional performance and reliability. Benefit from fast switching times, low on-state resistance, and high off-state isolation to optimize your circuits. Trust Onsemi's expertise in semiconductor manufacturing to bring you quality components that meet your design needs. Elevate your projects with the NLVHC1G66MUR2G multiplexer today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for a wide range of applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation onto circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage (Vsup): 3 V

The 3V nominal supply voltage ensures compatibility with a variety of systems and power sources.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand high temperatures and harsh environments, making it reliable for industrial use.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption and high-speed operation, making it energy-efficient and responsive.

Technical Specifications

Multiplexers & Switches NLVHC1G66MUR2G attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e4

Length:

1.2 mm

Normal Position (V):

NO

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Nominal Off-state Isolation:

80 dB

Maximum On-state Resistance (Ron):

60 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Maximum Switch-off Time:

50 ns

Maximum Switch-on Time:

50 ns

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Width (mm):

1 mm

Trade Compliance

NLVHC1G66MUR2G Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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