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NLV74HC4316ADR2G

Onsemi

NLV74HC4316ADR2G by Onsemi

NLV74HC4316ADR2G by Onsemi is a CMOS SPST multiplexer with 4 functions, operating b/w -55 to 125 °C. It has a max on-state resistance of 240 ohm and supports separate output at 2/6V. Ideal for military-grade applications requiring small outline packages in surface-mount technology.

Median Price

$0.257

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 156,048 parts In-Stock

1+ parts

-

100+ parts

$0.257

1k+ parts

$0.214

10k+ parts

$0.191

156,048

-

$0.257

$0.214

$0.191

DigiKey

USA . 156,048 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.320

10k+ parts

-

156,048

-

-

$0.320

-

Verical

USA . 150,669 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.238

150,669

-

-

-

$0.238

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,935 parts In-Stock

1+ parts

$0.200

100+ parts

-

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1,935

$0.200

-

-

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Vyrian

USA . 1,651 parts In-Stock

1+ parts

$0.211

100+ parts

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1,651

$0.211

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,538 parts In-Stock

1+ parts

$0.190

100+ parts

-

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1,538

$0.190

-

-

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Corohmni

South Africa . 442 parts In-Stock

1+ parts

$0.211

100+ parts

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442

$0.211

-

-

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Vigor

Singapore . 447 parts In-Stock

1+ parts

$0.310

100+ parts

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447

$0.310

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Microchip USA

USA . 7,131 parts In-Stock

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7,131

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Problanco Electronics

Mexico . 4,811 parts In-Stock

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4,811

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SupplyDigital Components

Austria . 2,911 parts In-Stock

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2,911

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TANS Electronics

Latvia . 1,832 parts In-Stock

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1,832

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Kulean Microsystems

USA . 1,410 parts In-Stock

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1,410

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UHIMA Technologies

Türkiye . 794 parts In-Stock

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794

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Overview

Discover the NLV74HC4316ADR2G by Onsemi, a versatile multiplexer & switch that offers top-notch quality and reliability. With Onsemi's reputation for excellence in manufacturing, this product is designed to meet the demands of various applications with ease. From industrial automation to consumer electronics, this small outline package delivers superior performance and efficiency. Experience the benefits of seamless switching, separate outputs, and low on-state resistance, all packed into a military-grade design. Upgrade your projects with the NLV74HC4316ADR2G and unlock a world of possibilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability to the product.

Surface Mount: YES

Surface mount capability allows for easy installation and saves space on the PCB.

No. of Functions: 4

With 4 functions, this multiplexer/switch offers versatility and flexibility in signal routing.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and easily integrated into circuit designs.

Power Supplies (V): 2/6

Compatible with a range of power supply voltages, increasing its usability in different applications.

No. of Terminals: 16

With 16 terminals, this product can handle multiple inputs and outputs efficiently.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, especially in compact electronic devices.

Maximum Operating Temperature: 125 °C

Capable of operating at temperatures up to 125 °C, suitable for demanding environments.

Minimum Operating Temperature: -55 °C

Supports operation in low-temperature conditions down to -55 °C.

Terminal Finish: MATTE TIN

MATTE TIN terminal finish provides good electrical conductivity and solderability.

Terminal Position: DUAL

Dual terminal position offers flexibility in PCB layout and connection options.

Output (V) : SEPARATE OUTPUT

Separate output ensures individual signal paths for each function, reducing crosstalk.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable solder joints.

Peak Reflow Temperature °C: 260

Capable of withstanding high peak reflow temperature of 260 °C during soldering process.

Maximum On-state Resistance (Ron): 240 ohm

Low on-state resistance of 240 ohms ensures minimal signal loss during switching.

Temperature Grade: MILITARY

Military-grade temperature rating ensures reliability in harsh environmental conditions.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

Gull wing terminal form offers easy surface mounting and secure solder connections.

Terminal Pitch: 1.27 mm

Fine pitch of 1.27 mm allows for high-density mounting on PCBs, saving space.

Technical Specifications

Multiplexers & Switches NLV74HC4316ADR2G attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO

No. of Functions:

4

No. of Terminals:

16

Maximum On-state Resistance (Ron):

240 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NLV74HC4316ADR2G Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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