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NLV74HC4066ADR2G

Onsemi

NLV74HC4066ADR2G by Onsemi

NLV74HC4066ADR2G by Onsemi is a CMOS SPST switch with 4 functions, 120 ohm Ron, and 100 ns switch-on time. It operates at -55 to 125 °C and is ideal for military-grade applications requiring separate output switching up to 12 V.

Median Price

$0.180

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,213 parts In-Stock

1+ parts

$0.390

100+ parts

$0.209

1k+ parts

$0.176

10k+ parts

$0.166

2,213

$0.390

$0.209

$0.176

$0.166

Rochester

USA . 9,020 parts In-Stock

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9,020

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Arrow

USA . 5,000 parts In-Stock

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$0.157

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$0.157

Verical

USA . 2,798 parts In-Stock

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$0.180

2,798

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$0.180

Distributors (In-Stock)

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$0.188

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500

$0.188

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Digiode

USA . 1,820 parts In-Stock

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$0.484

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1,820

$0.484

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Vyrian

USA . 264 parts In-Stock

1+ parts

$0.510

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264

$0.510

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Bristol Electronics

USA . 77 parts In-Stock

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$0.375

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77

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$0.375

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Distributors (Availability)

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Vigor

Singapore . 568 parts In-Stock

1+ parts

$0.220

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568

$0.220

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Corphita

USA . 334 parts In-Stock

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$0.459

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334

$0.459

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Corohmni

South Africa . 107 parts In-Stock

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$0.510

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107

$0.510

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Microchip USA

USA . 5,216 parts In-Stock

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$1.577

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$1.577

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Kulean Microsystems

USA . 4,605 parts In-Stock

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TANS Electronics

Latvia . 4,027 parts In-Stock

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Futuretech Components

Singapore . 2,224 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Problanco Electronics

Mexico . 1,752 parts In-Stock

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SupplyDigital Components

Austria . 1,032 parts In-Stock

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UHIMA Technologies

Türkiye . 727 parts In-Stock

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727

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Overview

Experience superior performance and reliability with the NLV74HC4066ADR2G by Onsemi. This multiplexers & switches device offers advanced functionality in a compact package, making it ideal for a wide range of applications. Trust in Onsemi's reputation for quality and innovation to deliver exceptional results every time. Enhance your projects with seamless switching capabilities and precision control. Elevate your creations with the NLV74HC4066ADR2G and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient PCB assembly, saving time and effort during production.

No. of Functions: 4

Having 4 functions in one device provides versatility and flexibility in designing circuits, reducing the need for multiple components.

Nominal Supply Voltage (Vsup): 3 V

The nominal supply voltage of 3 V allows for compatibility with a wide range of voltage requirements, making it versatile for various applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C ensures reliability and stability even in demanding environmental conditions.

Technology: CMOS

The use of CMOS technology offers low power consumption and high noise immunity, making the device energy-efficient and reliable.

Technical Specifications

Multiplexers & Switches NLV74HC4066ADR2G attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO

No. of Channels:

1

No. of Functions:

4

No. of Terminals:

14

Nominal On-state Resistance Match:

20 ohm

Maximum On-state Resistance (Ron):

120 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/12

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Maximum Switch-off Time:

110 ns

Maximum Switch-on Time:

100 ns

Switching (V):

MAKE-BEFORE-BREAK

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

NLV74HC4066ADR2G Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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