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NLAS7213MUTAG

Onsemi

NLAS7213MUTAG by Onsemi

NLAS7213MUTAG by Onsemi is an 8-terminal DPST switch with a 1.65V min supply voltage and 4.5V max supply voltage. It features a max on-state resistance of 9 ohm, switching time of 30 ns, and operates in industrial temperature grades. Ideal for applications requiring fast switching and low on-state resistance in compact designs.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 6,395 parts In-Stock

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AZTECH Wire

Italy . 558 parts In-Stock

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Component Stockers USA

USA . 775 parts In-Stock

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$99.990

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TANS Electronics

Latvia . 8,003 parts In-Stock

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SupplyDigital Components

Austria . 6,593 parts In-Stock

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Problanco Electronics

Mexico . 2,808 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 510 parts In-Stock

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Microchip USA

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Kulean Microsystems

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Corohmni

South Africa . 138 parts In-Stock

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Overview

Discover the NLAS7213MUTAG by Onsemi, a high-quality multiplexer and switch that offers exceptional value to customers. With a reliable manufacturer like Onsemi, you can trust in the superior performance and durability of this product. Ideal for a variety of applications, this surface-mount device features separate outputs and a very thin profile package style for easy integration into your designs. Whether you're looking for a DPST IC type or industrial-grade temperature tolerance, the NLAS7213MUTAG delivers on all fronts. Upgrade your projects with this versatile and efficient solution today!

Feature Benefit Bullets

Surface Mount: YES

Ease of installation on PCBs, reduces assembly time and cost.

Nominal Supply Voltage (Vsup): 3.3 V

Compatible with commonly used power supply voltages, making it versatile for various applications.

Maximum Operating Temperature: 85 °C

Can operate in high temperature environments, increasing the range of applications it can be used for.

Minimum Operating Temperature: -40 °C

Can operate in low temperature environments, making it suitable for a wide range of operating conditions.

Maximum On-state Resistance (Ron): 9 ohm

Low resistance helps in efficient signal transmission.

Technical Specifications

Multiplexers & Switches NLAS7213MUTAG attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N8

JESD-609 Code:

e4

Length:

1.5 mm

Normal Position (V):

NC

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Nominal Off-state Isolation:

20 dB

Nominal On-state Resistance Match:

.25 ohm

Maximum On-state Resistance (Ron):

9 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC8,.06SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/4.3

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Maximum Switch-off Time:

25 ns

Maximum Switch-on Time:

30 ns

Switching (V):

BREAK-BEFORE-MAKE

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

1.5 mm

Trade Compliance

NLAS7213MUTAG Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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