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NL27WZ125USG-F22190

Onsemi

NL27WZ125USG-F22190 by Onsemi

NL27WZ125USG-F22190 by Onsemi is a 2-function bus driver with 3-STATE output. It operates at -55 to 125 °C, with Vsup ranging from 1.65V to 5.5V and ICC of 100mA. With a propagation delay of 13ns, it's ideal for bidirectional control applications in compact designs due to its small outline package style and low profile design.

Median Price

$0.083

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,900 parts In-Stock

1+ parts

$0.352

100+ parts

-

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$0.080

1,900

$0.352

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$0.080

Future Electronics

Canada . 6,000 parts In-Stock

1+ parts

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$0.071

6,000

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$0.071

Verical

USA . 3,000 parts In-Stock

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$0.083

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3,000

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$0.083

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Distributors (In-Stock)

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Nova Conductors

Japan . 59 parts In-Stock

1+ parts

$0.124

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59

$0.124

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Digiode

USA . 975 parts In-Stock

1+ parts

$0.334

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975

$0.334

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Flip Electronics

USA . 21,000 parts In-Stock

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Vyrian

USA . 6,297 parts In-Stock

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6,297

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IBS Electronics

USA . 6,000 parts In-Stock

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$0.092

6,000

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$0.092

Distributors (Availability)

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Semicontronic

India . 2,376 parts In-Stock

1+ parts

$0.071

100+ parts

$0.069

1k+ parts

$0.069

10k+ parts

-

2,376

$0.071

$0.069

$0.069

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Ampacity Inc.

Singapore . 2,315 parts In-Stock

1+ parts

$0.071

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2,315

$0.071

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Corohmni

South Africa . 53 parts In-Stock

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$0.083

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53

$0.083

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Continental Prestige Electronics

USA . 6,843 parts In-Stock

1+ parts

$0.124

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$0.121

6,843

$0.124

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$0.121

Argo Parts USA

USA . 4,097 parts In-Stock

1+ parts

$0.124

100+ parts

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$0.120

4,097

$0.124

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$0.120

Corphita

USA . 347 parts In-Stock

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$0.317

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347

$0.317

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Component Stockers USA

USA . 2,481 parts In-Stock

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$0.370

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Microchip USA

USA . 2,526 parts In-Stock

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$2.600

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$2.600

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AZTECH Wire

Italy . 651 parts In-Stock

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$18.490

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651

$18.490

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Eastek

USA . 36,000 parts In-Stock

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$0.120

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GreenTree Electronics

Israel . 18,000 parts In-Stock

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SupplyDigital Components

Austria . 7,603 parts In-Stock

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Problanco Electronics

Mexico . 4,172 parts In-Stock

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TANS Electronics

Latvia . 2,949 parts In-Stock

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Glotronic Ltd.

UK . 2,400 parts In-Stock

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UHIMA Technologies

Türkiye . 985 parts In-Stock

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Kulean Microsystems

USA . 749 parts In-Stock

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749

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Overview

Discover the cutting-edge NL27WZ125USG-F22190 by Onsemi, a top-tier manufacturer known for superior quality and reliability. As a Bus Driver & Transceivers component, this product offers unmatched performance in various applications. With a small outline, very thin profile, and shrink pitch package style, this device provides 3-STATE output characteristics and a true output polarity, ensuring optimal functionality. Experience the benefits of fast propagation delay, wide operating temperature range, and low power consumption. Upgrade your projects with the NL27WZ125USG-F22190 and unlock a world of possibilities!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures that the product is sturdy and can withstand rough handling.

Surface Mount: YES

Being surface mountable makes the installation process easier and more convenient.

No. of Functions: 2

Having multiple functions in one product offers versatility and can save space in circuit designs.

Nominal Supply Voltage / Vsup (V): 2.3

The nominal supply voltage of 2.3V is within a common operating range, making it compatible with a variety of systems.

Propagation Delay (tpd): 13 ns

With a low propagation delay, this product offers fast signal transmission and response times.

Output Characteristics: 3-STATE

The 3-STATE output allows the bus driver to be in a high-impedance state when not actively driving the bus, reducing power consumption and preventing signal conflicts.

Technology: CMOS

The use of CMOS technology ensures low power consumption and compatibility with modern circuit designs.

Technical Specifications

Bus Driver & Transceivers NL27WZ125USG-F22190 attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

2.3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

100 mA

Propagation Delay (tpd):

13 ns

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

NL27WZ125USG-F22190 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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