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NIS6150MT1TXG

Onsemi

NIS6150MT1TXG by Onsemi

NIS6150MT1TXG by Onsemi is a Power Management IC with 10 terminals, operating temperature range of -40 to 125 °C, and adjustable threshold. It is designed for automotive applications, featuring a small outline package with heat sink/slug and very thin profile ideal for power supply support circuits.

Median Price

$0.565

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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RS (Exports)

UK . 650 parts In-Stock

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Flip Electronics

USA . 9,000 parts In-Stock

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$0.457

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Vyrian

USA . 3,593 parts In-Stock

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Digiode

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Corohmni

South Africa . 267 parts In-Stock

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Microchip USA

USA . 5,242 parts In-Stock

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$4.894

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AZTECH Wire

Italy . 39 parts In-Stock

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$19.900

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TANS Electronics

Latvia . 7,413 parts In-Stock

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Problanco Electronics

Mexico . 6,261 parts In-Stock

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SupplyDigital Components

Austria . 6,026 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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iodParts Technologies Inc.

India . 2,950 parts In-Stock

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Corphita

USA . 1,669 parts In-Stock

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UHIMA Technologies

Türkiye . 847 parts In-Stock

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Kulean Microsystems

USA . 558 parts In-Stock

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Overview

Enhance your power management needs with the NIS6150MT1TXG by Onsemi. With a reputation for quality and reliability, Onsemi delivers cutting-edge Power Management ICs that are designed to meet the demands of various applications. This small outline, heat sink package offers a very thin profile, making it ideal for automotive use. Enjoy the benefits of adjustable threshold, surface mount capability, and a wide temperature range. Trust Onsemi to provide innovative solutions for all your power supply support circuit requirements. Elevate your performance with the NIS6150MT1TXG today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the Power Management IC, ensuring a longer lifespan.

Surface Mount: YES

Ease of installation and space-saving design make this Power Management IC suitable for compact electronic devices.

Nominal Supply Voltage (Vsup): 5 V

Compatible with many standard electronic systems that require a 5V supply voltage.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for applications where heat dissipation is a concern.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards, ensuring reliability and performance in vehicular applications.

Adjustable Threshold: YES

Allows for customization and fine-tuning of the threshold values, providing flexibility in various power management scenarios.

Technical Specifications

Power Management ICs NIS6150MT1TXG attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

Electronic Fuse

Adjustable Threshold:

YES

JESD-30 Code:

S-XDSO-N10

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC10,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

10

Width (mm):

3 mm

Trade Compliance

NIS6150MT1TXG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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