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NIS6251MT2TXG

Onsemi

NIS6251MT2TXG by Onsemi

NIS6251MT2TXG by Onsemi is a Power Management IC with 10 terminals, operating b/w -40 to 125 °C. It has a nominal voltage of 5V and max seated height of 0.8mm. Ideal for automotive applications, this IC supports power supply circuits with adjustable threshold and surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,253 parts In-Stock

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2,253

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Vyrian

USA . 1,634 parts In-Stock

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1,634

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Distributors (Availability)

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Problanco Electronics

Mexico . 5,965 parts In-Stock

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5,965

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Kulean Microsystems

USA . 3,833 parts In-Stock

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3,833

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TANS Electronics

Latvia . 1,735 parts In-Stock

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1,735

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Corphita

USA . 682 parts In-Stock

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682

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UHIMA Technologies

Türkiye . 569 parts In-Stock

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569

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SupplyDigital Components

Austria . 382 parts In-Stock

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382

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Corohmni

South Africa . 299 parts In-Stock

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299

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Overview

Discover the power of precision with the NIS6251MT2TXG by Onsemi. As a leader in Power Management ICs, Onsemi delivers cutting-edge technology and superior quality in every product. Ideal for a variety of applications, this small outline, heat sink profile IC offers unmatched performance and reliability. With adjustable thresholds and automotive-grade temperature capabilities, customers can trust in the value and benefits this innovative solution provides. Experience the difference with Onsemi's NIS6251MT2TXG – where excellence meets efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to environmental factors, making this product a reliable choice for various applications.

Surface Mount: YES

Being surface mountable makes the installation process easier and more efficient, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 5 V

The nominal supply voltage of 5V is commonly used in many electronic devices, making this power management IC compatible with a wide range of applications.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style allows for space-saving design and efficient heat dissipation, making it suitable for compact electronic devices.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this power management IC can withstand high temperature environments, ensuring stable performance under various conditions.

Adjustable Threshold: YES

The ability to adjust the threshold allows for customization and precise control over the power management functions, making this product versatile and adaptable to different requirements.

Technical Specifications

Power Management ICs NIS6251MT2TXG attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PDSO-N10

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC10,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.8 mm

Maximum Supply Current (Isup):

.8 mA

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

NIS6251MT2TXG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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