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NDS8947

Onsemi

NDS8947 by Onsemi

NDS8947 by Onsemi is a P-CHANNEL FET with 2 elements & built-in diode, ideal for SWITCHING applications. Features include 30V DS Breakdown Voltage, 0.065 ohm Drain-Source Resistance, and 4A Drain Current. Operates in -55 to 150 °C temperature range, with GULL WING terminals in SMALL OUTLINE package.

Median Price

$1.230

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,899 parts In-Stock

1+ parts

-

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$1.230

1k+ parts

$1.020

10k+ parts

$0.910

6,899

-

$1.230

$1.020

$0.910

Farnell

UK . 6,899 parts In-Stock

1+ parts

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$1.180

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$1.120

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6,899

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$1.180

$1.120

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Verical

USA . 2,909 parts In-Stock

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$1.275

10k+ parts

$1.138

2,909

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$1.275

$1.138

Distributors (In-Stock)

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DF Sales Co.

USA . 1,570 parts In-Stock

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$0.800

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1,570

$0.800

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DF Sales Co.

USA . 1,570 parts In-Stock

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$0.800

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1,570

$0.800

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Digiode

USA . 2,125 parts In-Stock

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$0.960

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$0.960

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Vyrian

USA . 3,014 parts In-Stock

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$1.010

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$1.010

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DigiKey Marketplace

USA . 6,899 parts In-Stock

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6,899

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Bristol Electronics

USA . 6,115 parts In-Stock

1+ parts

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100+ parts

$0.422

1k+ parts

$0.315

10k+ parts

$0.292

6,115

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$0.422

$0.315

$0.292

EMSNET

USA . 2,190 parts In-Stock

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Anansix

USA . 1,753 parts In-Stock

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Atlantic Semiconductor

USA . 1,166 parts In-Stock

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Electronic Expediters

USA . 1,069 parts In-Stock

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1,069

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R&J Components

USA . 293 parts In-Stock

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293

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Global Solutions Electronics Company

USA . 100 parts In-Stock

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100

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Semi Source

USA . 73 parts In-Stock

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Prism Electronics

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Distributors (Availability)

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Corohmni

South Africa . 124 parts In-Stock

1+ parts

$0.800

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124

$0.800

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Ampacity Inc.

Singapore . 5,547 parts In-Stock

1+ parts

$0.860

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5,547

$0.860

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Corphita

USA . 2,970 parts In-Stock

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$0.909

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2,970

$0.909

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Component Stockers USA

USA . 10,102 parts In-Stock

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$1.040

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$0.980

1k+ parts

$0.890

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10,102

$1.040

$0.980

$0.890

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Continental Prestige Electronics

USA . 6,899 parts In-Stock

1+ parts

$1.510

100+ parts

$1.180

1k+ parts

$1.120

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6,899

$1.510

$1.180

$1.120

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Microchip USA

USA . 240 parts In-Stock

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$6.305

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240

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Metaverse IC Inc.

Canada . 36,530 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 29,683 parts In-Stock

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A-Z Elektronik GmbH

Germany . 9,814 parts In-Stock

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Perfect Parts

USA . 8,400 parts In-Stock

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SupplyDigital Components

Austria . 6,212 parts In-Stock

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Kulean Microsystems

USA . 4,386 parts In-Stock

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TANS Electronics

Latvia . 3,379 parts In-Stock

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Kepictronics

USA . 1,650 parts In-Stock

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Supply Digital

USA . 1,205 parts In-Stock

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Problanco Electronics

Mexico . 349 parts In-Stock

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UHIMA Technologies

Türkiye . 93 parts In-Stock

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Overview

Unlock the power of innovation with the NDS8947 by Onsemi, a top-quality P-channel field-effect transistor designed for switching applications. Manufactured by Onsemi, a trusted leader in semiconductor technology, this small signal FET offers unbeatable value and performance. With its built-in diode and high power dissipation capacity, it's perfect for a wide range of electronic devices. Trust Onsemi for cutting-edge solutions that bring reliability and efficiency to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is reliable and durable, ensuring a long lifespan for the product.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their high input impedance and low input capacitance, making them ideal for switching applications.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and enhances efficiency in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in such scenarios.

Surface Mount: YES

Surface mount design allows for easy integration onto circuit boards, saving space and reducing overall assembly time.

Minimum DS Breakdown Voltage: 30 V

With a high breakdown voltage, this FET can handle higher voltages, making it versatile for a range of applications.

Package Shape: RECTANGULAR

Rectangular shape is commonly used and makes it easy to mount and handle during assembly.

Terminal Form: GULL WING

Gull wing terminals provide a secure connection and are suitable for surface mounting applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easy to control and offer high input impedance, improving overall circuit performance.

Maximum Power Dissipation (Abs): 2 W

With a maximum power dissipation of 2W, this FET can handle high power loads without overheating.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board and is suitable for compact designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and reliability, ensuring consistent performance.

Maximum Operating Temperature: 150 °C

Can operate efficiently at high temperatures, making it suitable for a wide range of environments.

Transistor Element Material: SILICON

Silicon is a common and reliable material for FETs, providing good overall performance and durability.

Minimum Operating Temperature: -55 °C

Can operate in extreme cold temperatures, ensuring functionality in various environmental conditions.

Maximum Drain Current (ID): 4 A

With a maximum drain current of 4A, this FET can handle high current loads, suitable for power applications.

Maximum Drain-Source On Resistance: 0.065 ohm

Low drain-source on resistance minimizes power loss and improves efficiency in switching applications.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit design and ease of connection.

Technical Specifications

Small Signal Field Effect Transistors (FET) NDS8947 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

4 A

Maximum Drain-Source On Resistance:

.065 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

2 W

Maximum Power Dissipation (Abs):

2 W

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NDS8947 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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