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NDDL1N60ZT4G

Onsemi

NDDL1N60ZT4G by Onsemi

NDDL1N60ZT4G by Onsemi is a N-CHANNEL FET with 0.8A max drain current and 25W max power dissipation. Ideal for power applications, it operates at up to 150 °C, making it suitable for various electronic devices requiring high-performance transistors in surface-mount configurations.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,945 parts In-Stock

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Vyrian

USA . 116 parts In-Stock

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116

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TANS Electronics

Latvia . 8,295 parts In-Stock

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SupplyDigital Components

Austria . 7,678 parts In-Stock

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Problanco Electronics

Mexico . 6,431 parts In-Stock

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Kulean Microsystems

USA . 4,036 parts In-Stock

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Corphita

USA . 1,306 parts In-Stock

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UHIMA Technologies

Türkiye . 429 parts In-Stock

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Corohmni

South Africa . 344 parts In-Stock

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Overview

Enhance your electronic designs with the NDDL1N60ZT4G by Onsemi, a high-quality Power Field Effect Transistor that promises reliability and efficiency. Manufactured by Onsemi, a trusted name in the industry, this N-channel FET offers superior performance for a wide range of applications. With its single configuration and surface mount capability, this transistor is easy to integrate into your projects. Experience the benefits of its maximum drain current and power dissipation, allowing for seamless operation even at high temperatures. Upgrade your designs with the NDDL1N60ZT4G and enjoy enhanced functionality and performance.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have lower on-state resistance compared to P-Channel FETs, making them more efficient for many applications.

Configuration: SINGLE

Single configuration FETs are easier to design with and integrate into circuits, simplifying the overall system design.

Surface Mount: YES

Surface-mount FETs are compact and allow for dense PCB layouts, saving space in the overall system design.

Maximum Drain Current (Abs) (ID): 0.8 A

The high maximum drain current allows for the FET to handle moderate power requirements efficiently and reliably.

Maximum Power Dissipation (Abs): 25 W

High power dissipation capability enables the FET to handle power spikes or continuous high-power operation without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor FETs offer good switching speeds and low gate capacitance, making them suitable for high-frequency applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can withstand higher temperature environments, increasing its reliability in various applications.

Technical Specifications

Power Field Effect Transistors (FET) NDDL1N60ZT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

.8 A

Maximum Drain Current (ID):

.8 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

NDDL1N60ZT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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