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NDDL01N60ZT4G

Onsemi

NDDL01N60ZT4G by Onsemi

NDDL01N60ZT4G by Onsemi is a Power FET with 600V DS Breakdown Voltage, 3.4A IDM, and 15 ohm RDS(on). Ideal for power applications requiring high voltage tolerance and low on-resistance. Suitable for use in enhancement mode operation at temperatures ranging from -55 to 150°C.

Median Price

$0.195

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 22,500 parts In-Stock

1+ parts

-

100+ parts

$0.211

1k+ parts

$0.175

10k+ parts

$0.156

22,500

-

$0.211

$0.175

$0.156

DigiKey

USA . 22,500 parts In-Stock

1+ parts

-

100+ parts

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$0.180

22,500

-

-

-

$0.180

Verical

USA . 22,500 parts In-Stock

1+ parts

-

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-

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$0.195

22,500

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-

-

$0.195

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,467 parts In-Stock

1+ parts

$0.131

100+ parts

-

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2,467

$0.131

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Digiode

USA . 1,995 parts In-Stock

1+ parts

$0.164

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1,995

$0.164

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 63 parts In-Stock

1+ parts

$0.131

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-

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63

$0.131

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Corphita

USA . 494 parts In-Stock

1+ parts

$0.156

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494

$0.156

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Component Stockers USA

USA . 16,153 parts In-Stock

1+ parts

$0.180

100+ parts

$0.160

1k+ parts

$0.150

10k+ parts

$0.150

16,153

$0.180

$0.160

$0.150

$0.150

Continental Prestige Electronics

USA . 22,500 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.125

10k+ parts

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22,500

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$0.125

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TANS Electronics

Latvia . 6,503 parts In-Stock

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6,503

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SupplyDigital Components

Austria . 5,598 parts In-Stock

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5,598

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Kulean Microsystems

USA . 2,202 parts In-Stock

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2,202

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Problanco Electronics

Mexico . 1,643 parts In-Stock

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1,643

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UHIMA Technologies

Türkiye . 429 parts In-Stock

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429

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Overview

Discover the power of the NDDL01N60ZT4G by Onsemi, a top-quality N-CHANNEL Power Field Effect Transistor with a built-in diode. Designed for enhanced performance and reliability, this transistor offers a wide range of applications in various industries. With a high DS Breakdown Voltage of 600V and maximum power dissipation of 26W, this transistor provides exceptional value and benefits to customers seeking efficient power solutions. Trust in Onsemi's expertise and innovation to deliver superior products that meet your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL polarity or channel type allows for efficient control and operation of the transistor, making it suitable for different circuit designs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and provides protection against back EMF, making the product versatile and reliable.

Surface Mount: YES

Surface mount capability enables easy and compact integration of the transistor onto circuit boards, saving space and facilitating automated assembly.

Minimum DS Breakdown Voltage: 600 V

The high minimum breakdown voltage of 600V ensures reliable and safe operation in high voltage applications.

Package Shape: RECTANGULAR

The rectangular package shape provides easy mounting and efficient use of space on circuit boards.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for precise control and efficient performance of the transistor in various applications.

Maximum Pulsed Drain Current (IDM): 3.4 A

The high maximum pulsed drain current of 3.4A enables the transistor to handle high current loads effectively.

Avalanche Energy Rating (EAS): 12 mJ

The high avalanche energy rating of 12mJ indicates the ability of the transistor to withstand high energy transient events without damage.

Maximum Drain Current (Abs) (ID): 0.8 A

The maximum drain current rating of 0.8A ensures reliable performance under normal operating conditions.

No. of Terminals: 2

Having only 2 terminals simplifies the circuit connection and reduces complexity in circuit design.

Maximum Power Dissipation (Abs): 26 W

The high maximum power dissipation rating of 26W allows the transistor to handle high power loads without overheating.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board and facilitates compact designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency, low power consumption, and fast switching speeds, making it suitable for various applications.

Temperature: Maximum Operating Temperature: 150 °C, Minimum Operating Temperature: -55 °C

The wide operating temperature range of -55°C to 150°C allows the transistor to function reliably in extreme temperature conditions.

Transistor Element Material: SILICON

Silicon material provides high thermal conductivity and reliable performance, making the transistor suitable for demanding applications.

Terminal Finish: TIN

Tin terminal finish ensures good solderability and reliable electrical connections for stable performance.

Maximum Drain-Source On Resistance: 15 ohm

The low maximum drain-source on resistance of 15 ohms minimizes power losses and improves the efficiency of the transistor.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 ensures that the transistor is resistant to moisture, making it suitable for a wide range of environments.

Case Connection: DRAIN

The drain case connection simplifies the circuit design and provides efficient heat dissipation for improved reliability.

Maximum Time At Peak Reflow Temperature (s): 30, Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C and maximum time at peak reflow temperature of 30 seconds ensure reliable solder joints during assembly.

Maximum Feedback Capacitance (Crss): 3 pF

The low maximum feedback capacitance of 3pF minimizes signal distortion and interference, ensuring reliable performance in high-frequency applications.

Technical Specifications

Power Field Effect Transistors (FET) NDDL01N60ZT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

12 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

.8 A

Maximum Drain Current (ID):

.8 A

Maximum Drain-Source On Resistance:

15 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

3 pF

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

3.4 A

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NDDL01N60ZT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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