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NCV8406STT3G

Onsemi

NCV8406STT3G by Onsemi

NCV8406STT3G by Onsemi is a small outline peripheral driver with built-in protections against transient, over current, and over voltage. It has a nominal output peak current limit of 8.5A and a turn-on time of 0.127us. Ideal for applications requiring buffer or inverter based interface ICs in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 65,000 parts In-Stock

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Vyrian

USA . 7,906 parts In-Stock

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Digiode

USA . 1,124 parts In-Stock

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Vigor

Singapore . 163 parts In-Stock

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$0.600

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AZTECH Wire

Italy . 1,137 parts In-Stock

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$20.220

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Kepictronics

USA . 27,860 parts In-Stock

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Problanco Electronics

Mexico . 6,772 parts In-Stock

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TANS Electronics

Latvia . 5,797 parts In-Stock

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SupplyDigital Components

Austria . 5,051 parts In-Stock

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Corphita

USA . 1,973 parts In-Stock

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UHIMA Technologies

Türkiye . 624 parts In-Stock

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Kulean Microsystems

USA . 584 parts In-Stock

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Corohmni

South Africa . 155 parts In-Stock

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Microchip USA

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Overview

Enhance the performance and reliability of your electronic devices with the NCV8406STT3G by Onsemi. Manufactured by a trusted name in the industry, this peripheral driver offers built-in protections against transient events, over current, over voltage, and thermal issues. Ideal for a wide range of applications, this small outline package boasts a fast turn-on time and high output peak current limit of 8.5A, ensuring efficient operation. Upgrade your designs with this versatile and durable component that delivers exceptional value and benefits to customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, saving space and simplifying assembly.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Ensures the safety of connected devices and the peripheral driver itself by safeguarding against various electrical issues.

No. of Terminals: 4

Provides multiple connection points for a variety of devices, increasing versatility and compatibility.

Package Style (Meter): SMALL OUTLINE

Compact design allows for easy integration into tight spaces or densely packed circuits.

Terminal Finish: MATTE TIN

Enhances connectivity and conductivity, promoting efficient signal transmission.

Turn-on Time: 0.127 us

Quick response time ensures minimal delay in activating connected devices.

Nominal Output Peak Current Limit: 8.5 A

Capable of delivering high levels of current, making it suitable for power-hungry peripherals.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Offers flexibility in interfacing with different types of devices, enhancing compatibility.

Output Current Flow Direction: SINK

Designed for sinking current, which is common in many types of peripherals, ensuring optimal performance.

Technical Specifications

Peripheral Drivers NCV8406STT3G attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

4

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

8.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.3 mm

Terminal Position:

DUAL

Turn-off Time:

1.6 us

Turn-on Time:

.127 us

Width:

3.5 mm

Trade Compliance

NCV8406STT3G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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