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NCV8406DTRKG

Onsemi

NCV8406DTRKG by Onsemi

NCV8406DTRKG by Onsemi is a Peripheral Driver with built-in protections for transient, over current, and over voltage. It has a nominal output peak current limit of 8.5A and turn-on time of 0.127us. This small outline heat sink driver is ideal for buffer or inverter based applications requiring fast response times.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 2,620 parts In-Stock

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Digiode

USA . 2,384 parts In-Stock

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AZTECH Wire

Italy . 607 parts In-Stock

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$17.520

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Kepictronics

USA . 27,860 parts In-Stock

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SupplyDigital Components

Austria . 8,234 parts In-Stock

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Kulean Microsystems

USA . 7,231 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,498 parts In-Stock

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TANS Electronics

Latvia . 2,894 parts In-Stock

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Authorized Procurement Solutions

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Perfect Parts

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Corphita

USA . 1,199 parts In-Stock

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Problanco Electronics

Mexico . 1,100 parts In-Stock

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Corohmni

South Africa . 378 parts In-Stock

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Vigor

Singapore . 264 parts In-Stock

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UHIMA Technologies

Türkiye . 253 parts In-Stock

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Microchip USA

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Overview

Enhance the performance of your electronic devices with the NCV8406DTRKG by Onsemi! Manufactured by a trusted industry leader, this peripheral driver offers built-in protections against transient, over current, over voltage, and thermal issues. With a compact design and reliable terminal finish, this product is perfect for a wide range of applications. Experience the value and benefits of seamless operation and superior quality when you choose the NCV8406DTRKG for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product long-lasting and reliable.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, reducing assembly time and effort.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Ensures safety and reliability by protecting the device from potential damage due to various electrical faults or environmental conditions.

No. of Terminals: 2

Simplifies the circuit connection process and reduces the chance of wiring errors.

Terminal Finish: MATTE TIN

Provides a reliable electrical connection and resists corrosion, ensuring optimal performance over time.

Turn-on Time: 0.127 us

Enables quick activation of the peripheral driver, ensuring fast response times in the connected system.

Nominal Output Peak Current Limit: 8.5 A

Allows for a high peak current flow, making the product suitable for applications that require high power output.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Provides flexibility in interfacing with different types of devices, enhancing compatibility and usability.

Technical Specifications

Peripheral Drivers NCV8406DTRKG attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Length:

6.54 mm

No. of Functions:

1

No. of Terminals:

2

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

8.5 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Qualification:

Not Qualified

Maximum Seated Height:

2.51 mm

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.29 mm

Terminal Position:

SINGLE

Turn-off Time:

1.6 us

Turn-on Time:

.127 us

Width:

6.095 mm

Trade Compliance

NCV8406DTRKG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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