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NCV8405STT3G

Onsemi

NCV8405STT3G by Onsemi

NCV8405STT3G by Onsemi is a small outline peripheral driver with 4 terminals and matte tin finish. It features buffer or inverter interface IC type, suitable for surface mount applications. This rectangular plastic/epoxy package is ideal for various electronic devices requiring dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 64,000 parts In-Stock

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Vyrian

USA . 8,458 parts In-Stock

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Digiode

USA . 2,083 parts In-Stock

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2,083

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AZTECH Wire

Italy . 1,075 parts In-Stock

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$19.540

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1,075

$19.540

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Authorized Procurement Solutions

USA . 30,000 parts In-Stock

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Kepictronics

USA . 27,860 parts In-Stock

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SupplyDigital Components

Austria . 8,182 parts In-Stock

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Problanco Electronics

Mexico . 7,821 parts In-Stock

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TANS Electronics

Latvia . 4,155 parts In-Stock

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Kulean Microsystems

USA . 3,077 parts In-Stock

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Corphita

USA . 1,033 parts In-Stock

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UHIMA Technologies

Türkiye . 751 parts In-Stock

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Corohmni

South Africa . 109 parts In-Stock

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Microchip USA

USA . 101 parts In-Stock

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Overview

Enhance your electronic designs with the NCV8405STT3G by Onsemi, a top-tier manufacturer known for delivering high-quality semiconductor solutions. This peripheral driver offers unmatched reliability and precision, making it ideal for a wide range of applications. From automotive to industrial control systems, this product ensures optimal performance and seamless integration. Experience the value and benefits of Onsemi's expertise in semiconductor technology with the NCV8405STT3G, providing customers with the advantage they need in their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the peripheral driver easy to handle and less prone to damage during handling or installation.

Surface Mount: YES

Surface mount technology allows for easy and efficient mounting onto PCBs, saving space and enhancing the overall compactness of the product.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a standardized form factor, making it easy to integrate into existing circuit designs and layouts.

No. of Terminals: 4

Having 4 terminals allows for a simple and straightforward connection of the peripheral driver to other components or devices in a circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package style makes the peripheral driver space-efficient and suitable for applications where space is limited.

Terminal Finish: MATTE TIN

The matte tin finish on the terminals provides good conductivity and corrosion resistance, ensuring long-term reliability and performance.

Terminal Position: DUAL

Having dual terminal positions allows for flexibility in circuit design and installation, accommodating different orientation requirements.

Terminal Form: GULL WING

The gull wing terminal form is easy to solder and provides mechanical stability, ensuring secure connections and reliable operation.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The buffer or inverter based peripheral driver interface IC type offers versatility in signal processing and amplification, making it suitable for a wide range of peripheral driver applications.

Technical Specifications

Peripheral Drivers NCV8405STT3G attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

No. of Terminals:

4

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

NCV8405STT3G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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