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NCV78723MW0R2G

Onsemi

NCV78723MW0R2G by Onsemi

NCV78723MW0R2G by Onsemi is a graphics display driver with a max supply voltage of 3.6V and min of 3.05V, suitable for automotive applications. It features a package style of chip carrier, heat sink/slug, very thin profile, and operates in temperatures ranging from -40 to 150 °C. With surface mount capability and matte tin terminal finish, it offers efficient LED display driving with a low supply current of 6mA.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,191 parts In-Stock

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Digiode

USA . 721 parts In-Stock

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Vigor

Singapore . 555 parts In-Stock

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$2.260

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555

$2.260

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AZTECH Wire

Italy . 612 parts In-Stock

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$12.150

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$12.150

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Ampacity Inc.

Singapore . 750 parts In-Stock

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$14.500

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750

$14.500

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Component Stockers USA

USA . 299 parts In-Stock

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$99.990

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$99.990

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Perfect Parts

USA . 55,005 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 15,802 parts In-Stock

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RC Electronics

USA . 9,892 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,969 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Futuretech Components

Singapore . 4,968 parts In-Stock

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TANS Electronics

Latvia . 2,082 parts In-Stock

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Corphita

USA . 1,847 parts In-Stock

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SupplyDigital Components

Austria . 1,094 parts In-Stock

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Metaverse IC Inc.

Canada . 1,085 parts In-Stock

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Problanco Electronics

Mexico . 908 parts In-Stock

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Kulean Microsystems

USA . 527 parts In-Stock

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Microchip USA

USA . 498 parts In-Stock

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Corohmni

South Africa . 357 parts In-Stock

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UHIMA Technologies

Türkiye . 298 parts In-Stock

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Overview

Enhance your automotive display systems with the NCV78723MW0R2G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality graphics display drivers that offer unparalleled performance and reliability. Ideal for automotive applications, this product boasts a wide range of benefits, including low power consumption, high efficiency, and precise control. Upgrade your display systems today and experience the value and advantages that the NCV78723MW0R2G can bring to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for automotive applications.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for compatibility with a wide range of power sources.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures that the product can function reliably in extreme cold conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring long-term reliability.

Temperature Grade: AUTOMOTIVE

Being automotive grade, the product is designed to meet the rigorous requirements of automotive applications in terms of reliability and performance.

Technical Specifications

Graphics Display Drivers NCV78723MW0R2G attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.2SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Maximum Supply Current:

6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.05 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

NCV78723MW0R2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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