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NCV78702DE0R2G

Onsemi

NCV78702DE0R2G by Onsemi

NCV78702DE0R2G by Onsemi is a graphics display driver with serial data input mode. It operates b/w -40 to 150 °C and has a max supply voltage of 3.5 V, making it suitable for automotive LED display driver applications.

Median Price

$1.450

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,490 parts In-Stock

1+ parts

$2.220

100+ parts

$1.340

1k+ parts

$1.181

10k+ parts

$1.106

2,490

$2.220

$1.340

$1.181

$1.106

Verical

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.450

10k+ parts

$1.300

10,000

-

-

$1.450

$1.300

Rochester

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

$1.400

1k+ parts

$1.160

10k+ parts

$1.040

10,000

-

$1.400

$1.160

$1.040

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,287 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,287

-

-

-

-

Vyrian

USA . 1,455 parts In-Stock

1+ parts

-

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-

1k+ parts

-

10k+ parts

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1,455

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Problanco Electronics

Mexico . 5,399 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,399

-

-

-

-

SupplyDigital Components

Austria . 5,057 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

-

10k+ parts

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5,057

-

-

-

-

Kulean Microsystems

USA . 4,840 parts In-Stock

1+ parts

-

100+ parts

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4,840

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-

-

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TANS Electronics

Latvia . 2,941 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,941

-

-

-

-

Corphita

USA . 1,895 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,895

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UHIMA Technologies

Türkiye . 284 parts In-Stock

1+ parts

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100+ parts

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284

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-

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Corohmni

South Africa . 92 parts In-Stock

1+ parts

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92

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-

Overview

ISSI IS32LT3175N/P Single-Channel Linear LED Drivers come with fade in/out and PWM dimming. The regulators serve as a stand-alone LED driver-configurable from 20mA to 150mA with external resistors, no microcontroller is necessary. A logic level “courtesy light” signal from the PWM pin can be interfaced to precisely drive the LED channel. The IS32LT3175P obtains a positive polarity PWM signal. In addition, the IS32LT3175N obtains a negative polarity PWM signal. The regulator integrates a 63-step fade-in and fades out the algorithm (Gamma correction). This causes the output LED current to increasingly rise up to the full source value after the EN pin is pulsed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and lightweight construction, making the product suitable for various applications.

Data Input Mode: SERIAL

Serial data input mode allows for efficient and reliable data transfer, which is essential for graphics display drivers.

Surface Mount: YES

Surface mount capability enables easy installation and compact design, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.5 V

Higher maximum supply voltage ensures stable performance and compatibility with different power sources.

Package Shape: RECTANGULAR

Rectangular package shape provides a standardized form factor for easy integration into various electronic devices.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures reliable operation in challenging environments and automotive applications.

Terminal Form: GULL WING

Gull wing terminal form offers secure mechanical connection and ease of soldering during the assembly process.

Interface IC Type: LED DISPLAY DRIVER

LED display driver interface IC type indicates compatibility with LED displays, making it suitable for graphics applications.

Technical Specifications

Graphics Display Drivers NCV78702DE0R2G attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Data Input Mode:

SERIAL

Interface IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

3.5 V

Minimum Supply Voltage:

3.1 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

NCV78702DE0R2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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