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NCV7430D20G

Onsemi

NCV7430D20G by Onsemi

NCV7430D20G by Onsemi is a LED display driver with 14 terminals, operating at power supplies of 5.5-18V. This AEC-Q100 compliant device comes in a small outline package and features gull wing terminals for surface mount applications. Ideal for graphics display drivers in automotive and industrial electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,306 parts In-Stock

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2,306

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Vyrian

USA . 463 parts In-Stock

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463

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TANS Electronics

Latvia . 7,146 parts In-Stock

1+ parts

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7,146

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Problanco Electronics

Mexico . 4,344 parts In-Stock

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4,344

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Kulean Microsystems

USA . 4,264 parts In-Stock

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4,264

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Corphita

USA . 1,454 parts In-Stock

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1,454

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SupplyDigital Components

Austria . 930 parts In-Stock

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930

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UHIMA Technologies

Türkiye . 923 parts In-Stock

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923

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Corohmni

South Africa . 186 parts In-Stock

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186

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Overview

Enhance your visual experience with the NCV7430D20G by Onsemi. Crafted with precision and innovative technology, this LED display driver offers unparalleled performance and reliability. Whether you're designing a gaming monitor, digital signage, or automotive display, this product delivers exceptional quality and efficiency. With a wide voltage range and compact design, the NCV7430D20G provides unmatched value, making it the perfect solution for your display driver needs. Upgrade your visuals with Onsemi today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the components inside, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and enabling high-density designs.

Screening Level: AEC-Q100

AEC-Q100 compliance ensures high reliability and quality, making this driver suitable for automotive applications where robustness is crucial.

Power Supplies (V): 5.5/18

Support for a wide range of power supplies (5.5V to 18V) makes this driver versatile and compatible with different systems.

No. of Terminals: 14

Having 14 terminals allows for more connectivity options and better integration with other components in a display system.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for compact designs or where board real estate is limited.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and solderability, ensuring reliable connections and ease of assembly.

Terminal Form: GULL WING

Gull wing terminals offer mechanical strength and enhanced solder joint reliability, reducing the risk of connection failures.

Moisture Sensitivity Level (MSL): 2

MSL 2 rating indicates moderate sensitivity to moisture exposure, allowing for safe handling and storage under typical manufacturing conditions.

Interface IC Type: LED DISPLAY DRIVER

Designed specifically for driving LED displays, this interface IC type ensures optimal performance and compatibility with LED-based display systems.

Technical Specifications

Graphics Display Drivers NCV7430D20G attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

14

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5.5/18

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Sub-Category:

Display Drivers

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

NCV7430D20G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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