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NCV78663DQ0G

Onsemi

NCV78663DQ0G by Onsemi

NCV78663DQ0G by Onsemi is an AEC-Q100 compliant LED display driver with 36 terminals in a small outline package. It operates b/w -40 to 125 °C and supports power supplies of 5/40 V. Ideal for automotive applications, it features a gull wing terminal form and nickel palladium gold finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,717 parts In-Stock

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Digiode

USA . 1,601 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 852 parts In-Stock

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$14.740

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852

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QUARKTWIN TECHNOLOGY LTD

USA . 9,651 parts In-Stock

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TANS Electronics

Latvia . 7,586 parts In-Stock

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Kulean Microsystems

USA . 6,593 parts In-Stock

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Microchip USA

USA . 4,717 parts In-Stock

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SupplyDigital Components

Austria . 2,100 parts In-Stock

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Corphita

USA . 1,893 parts In-Stock

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Problanco Electronics

Mexico . 1,441 parts In-Stock

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Vigor

Singapore . 510 parts In-Stock

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UHIMA Technologies

Türkiye . 219 parts In-Stock

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Corohmni

South Africa . 180 parts In-Stock

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Overview

Unleash the power of stunning graphics with the NCV78663DQ0G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers unparalleled quality and reliability in all their products. Designed for automotive applications, this LED display driver offers seamless integration, high performance, and durability. Elevate your visual experience with the NCV78663DQ0G and see the world in a whole new light. Choose Onsemi for excellence in every detail.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and protects the internal components of the graphics display driver.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation of the graphics display driver on PCBs, saving time and effort during assembly.

Screening Level: AEC-Q100

AEC-Q100 screening ensures that the graphics display driver meets high automotive quality standards, making it suitable for automotive applications where reliability is crucial.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C allows the graphics display driver to operate efficiently even in harsh and demanding environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connection and long-term performance of the graphics display driver.

Moisture Sensitivity Level (MSL): 2

With an MSL of 2, the graphics display driver is less susceptible to moisture-related damage during storage, handling, and assembly, ensuring its reliability and longevity.

Technical Specifications

Graphics Display Drivers NCV78663DQ0G attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

36

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.4,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/40

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Sub-Category:

Display Drivers

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NCV78663DQ0G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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