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NCS2550SNT1G

Onsemi

NCS2550SNT1G by Onsemi

NCS2550SNT1G by Onsemi is a 5-terminal operational amplifier (Op Amp) with a small outline, thin profile package. It features a peak reflow temperature of 260 °C and is ideal for industrial applications requiring bipolar technology. The package shape is rectangular with gull wing terminal form, making it suitable for surface mount installations.

Median Price

$1.887

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$1.690

1k+ parts

$1.510

10k+ parts

$1.420

6,000

-

$1.690

$1.510

$1.420

DigiKey

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.230

10k+ parts

-

6,000

-

-

$2.230

-

Verical

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.887

10k+ parts

$1.775

6,000

-

-

$1.887

$1.775

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 88 parts In-Stock

1+ parts

$1.776

100+ parts

-

1k+ parts

-

10k+ parts

-

88

$1.776

-

-

-

Chip Stock

USA . 44,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

44,000

-

-

-

-

Vyrian

USA . 10,583 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,583

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,016 parts In-Stock

1+ parts

$1.683

100+ parts

-

1k+ parts

-

10k+ parts

-

2,016

$1.683

-

-

-

Vigor

Singapore . 320 parts In-Stock

1+ parts

$1.800

100+ parts

-

1k+ parts

-

10k+ parts

-

320

$1.800

-

-

-

Corohmni

South Africa . 231 parts In-Stock

1+ parts

$1.870

100+ parts

-

1k+ parts

-

10k+ parts

-

231

$1.870

-

-

-

Advanced Electronics

New Zealand . 870 parts In-Stock

1+ parts

$8.436

100+ parts

$7.677

1k+ parts

$6.918

10k+ parts

-

870

$8.436

$7.677

$6.918

-

AZTECH Wire

Italy . 99 parts In-Stock

1+ parts

$8.830

100+ parts

-

1k+ parts

-

10k+ parts

-

99

$8.830

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 17,069 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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17,069

-

-

-

-

Continental Prestige Electronics

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$1.770

1k+ parts

-

10k+ parts

-

6,000

-

$1.770

-

-

Kulean Microsystems

USA . 5,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,700

-

-

-

-

Microchip USA

USA . 4,136 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,136

-

-

-

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SupplyDigital Components

Austria . 4,116 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,116

-

-

-

-

TANS Electronics

Latvia . 2,517 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,517

-

-

-

-

Problanco Electronics

Mexico . 2,445 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,445

-

-

-

-

UHIMA Technologies

Türkiye . 575 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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575

-

-

-

-

Perfect Parts

USA . 19 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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19

-

-

-

-

Overview

Discover the NCS2550SNT1G by Onsemi, a high-quality Operational Amplifier designed to deliver top-notch performance in a compact package. Manufactured by Onsemi, a trusted leader in semiconductor solutions, this Op Amp is perfect for a wide range of applications. Its small outline, thin profile design makes it easy to integrate into any project, while its industrial-grade temperature rating ensures reliability in harsh environments. Experience the value and benefits of superior performance with the NCS2550SNT1G by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provides durability and helps protect the internal components of the operational amplifier.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, making installation and assembly efficient.

Package Shape: RECTANGULAR

Rectangular shape makes it easier to fit into compact spaces within electronic devices.

No. of Terminals: 5

Having 5 terminals provides flexibility in connecting the amplifier to various components in a circuit.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Small outline, thin profile, and shrink pitch design contribute to space-saving and compactness in electronic designs.

Terminal Finish: TIN

Tin terminal finish enhances conductivity and ensures reliable connections for optimal performance.

Terminal Position: DUAL

Dual terminal position allows for versatile circuit configurations and connectivity options.

Maximum Seated Height: 1.1 mm

Low seated height enables the operational amplifier to be used in applications with space constraints.

Width: 1.5 mm

Narrow width facilitates placement in tight spaces on PCBs, enhancing overall design flexibility.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures the operational amplifier can withstand reflow soldering processes without thermal damage.

Length: 3 mm

Compact length makes the operational amplifier suitable for designs where size is a critical factor.

Temperature Grade: INDUSTRIAL

Industrial temperature grade means the amplifier can operate reliably in a wide range of temperature environments.

Technology: BIPOLAR

Bipolar technology offers precise signal amplification and low noise performance ideal for many electronic applications.

Terminal Form: GULL WING

Gull wing terminal form provides secure solder joints and ease of surface mount installation.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier, this product is versatile and suitable for various analog circuit applications requiring amplification.

Terminal Pitch: 0.95 mm

Having a small terminal pitch enhances connection density and allows for compact PCB layouts.

Technical Specifications

Operational Amplifiers (Op Amps) NCS2550SNT1G attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Onsemi

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Total Functions:

1

Sub-Category:

Operational Amplifiers

Operational Characteristics

Peak Reflow Temperature:

260 °C (500 °F)

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.059 in (1.5 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

5

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Tin

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Trade Compliance

NCS2550SNT1G Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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