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NCS2530DTBG

Onsemi

NCS2530DTBG by Onsemi

NCS2530DTBG by Onsemi is a 16-terminal operational amplifier with 3 functions. It features a small outline package style and dual terminal position, suitable for industrial applications. With bipolar technology and gull wing terminal form, it offers high performance in compact designs.

Median Price

$1.375

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,536 parts In-Stock

1+ parts

-

100+ parts

$1.320

1k+ parts

$1.100

10k+ parts

$0.977

1,536

-

$1.320

$1.100

$0.977

DigiKey

USA . 1,536 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.650

10k+ parts

-

1,536

-

-

$1.650

-

Verical

USA . 1,152 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.375

10k+ parts

$1.221

1,152

-

-

$1.375

$1.221

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,067 parts In-Stock

1+ parts

$1.026

100+ parts

-

1k+ parts

-

10k+ parts

-

2,067

$1.026

-

-

-

Chip Stock

USA . 77,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

77,000

-

-

-

-

Vyrian

USA . 9,216 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,216

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 439 parts In-Stock

1+ parts

$0.972

100+ parts

-

1k+ parts

-

10k+ parts

-

439

$0.972

-

-

-

Vigor

Singapore . 726 parts In-Stock

1+ parts

$1.040

100+ parts

-

1k+ parts

-

10k+ parts

-

726

$1.040

-

-

-

Corohmni

South Africa . 375 parts In-Stock

1+ parts

$1.080

100+ parts

-

1k+ parts

-

10k+ parts

-

375

$1.080

-

-

-

AZTECH Wire

Italy . 619 parts In-Stock

1+ parts

$9.070

100+ parts

-

1k+ parts

-

10k+ parts

-

619

$9.070

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 21,662 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

21,662

-

-

-

-

SupplyDigital Components

Austria . 4,572 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,572

-

-

-

-

TANS Electronics

Latvia . 4,532 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,532

-

-

-

-

Kulean Microsystems

USA . 2,625 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,625

-

-

-

-

Problanco Electronics

Mexico . 1,958 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,958

-

-

-

-

Continental Prestige Electronics

USA . 1,536 parts In-Stock

1+ parts

-

100+ parts

$1.030

1k+ parts

-

10k+ parts

-

1,536

-

$1.030

-

-

UHIMA Technologies

Türkiye . 370 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

370

-

-

-

-

Microchip USA

USA . 305 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

305

-

-

-

-

Overview

Experience the next level of performance with the NCS2530DTBG operational amplifier by Onsemi. Crafted with precision and quality in mind, this amplifier offers unparalleled reliability and efficiency for a wide range of applications. Whether you're working on audio equipment, sensors, or control systems, this product's three functions and industrial-grade technology ensure seamless functionality. Transform your projects with the incredible value and benefits that the NCS2530DTBG brings to the table. Elevate your designs with Onsemi's exceptional amplifier and unlock new possibilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and insulation for the internal components, ensuring a long lifespan and reliable performance.

Surface Mount: YES

Allows for easy installation onto circuit boards, saving space and simplifying assembly processes.

No. of Functions: 3

Offers versatility and multiple functions in a single component, reducing the need for additional components and optimizing circuit design.

Package Shape: RECTANGULAR

Optimizes space utilization and allows for efficient placement on circuit boards.

No. of Terminals: 16

Provides ample connectivity options and flexibility for interfacing with other components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Enhances compactness and facilitates efficient heat dissipation to maintain optimal performance.

Terminal Finish: NICKEL PALLADIUM GOLD

Ensures reliable electrical connections and corrosion resistance for long-term usage.

Maximum Seated Height: 1.2 mm

Enables low-profile designs and compact integration into electronic devices.

Width: 4.4 mm

Contributes to the compact form factor and space-saving layout of the overall circuit.

Peak Reflow Temperature °C: 260

Supports high-temperature soldering processes, ensuring secure and durable connections during assembly.

Length: 5 mm

Adds to the overall compactness of the component and accommodates space-constrained applications.

Temperature Grade: INDUSTRIAL

Indicates robust performance and reliability in industrial environments with varying temperature conditions.

Technology: BIPOLAR

Known for its high input impedance and accurate output, making it suitable for precision applications requiring stable performance.

Terminal Form: GULL WING

Facilitates easy and secure soldering connections for efficient assembly and reliable operation.

Amplifier Type: OPERATIONAL AMPLIFIER

Designed for amplifying signals in various circuits, offering high gain, precision, and stability for signal processing applications.

Terminal Pitch: 0.65 mm

Provides fine pitch spacing for enhanced connectivity options and compatibility with modern electronics manufacturing standards.

Technical Specifications

Operational Amplifiers (Op Amps) NCS2530DTBG attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Onsemi

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Total Functions:

3

Sub-Category:

Operational Amplifiers

Operational Characteristics

Peak Reflow Temperature:

260 °C (500 °F)

Physical Characteristics

Length:

0.197 in (5 mm)

Width:

0.173 in (4.4 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

16

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Trade Compliance

NCS2530DTBG Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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