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NCS2502DG

Onsemi

NCS2502DG by Onsemi

NCS2502DG by Onsemi is an Operational Amplifier with 8 terminals in a small outline package. It features a peak reflow temperature of 260 °C, suitable for industrial applications. With bipolar technology and gull wing terminal form, it is ideal for surface mount designs requiring precise amplification.

Median Price

$1.193

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 882 parts In-Stock

1+ parts

-

100+ parts

$1.150

1k+ parts

$0.955

10k+ parts

$0.851

882

-

$1.150

$0.955

$0.851

DigiKey

USA . 882 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.440

10k+ parts

-

882

-

-

$1.440

-

Verical

USA . 882 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.193

10k+ parts

$1.064

882

-

-

$1.193

$1.064

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 608 parts In-Stock

1+ parts

$0.896

100+ parts

-

1k+ parts

-

10k+ parts

-

608

$0.896

-

-

-

Chip Stock

USA . 65,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

65,000

-

-

-

-

Vyrian

USA . 9,502 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,502

-

-

-

-

Zilex Electronics Inc.

Canada . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,476 parts In-Stock

1+ parts

$0.849

100+ parts

-

1k+ parts

-

10k+ parts

-

2,476

$0.849

-

-

-

Vigor

Singapore . 444 parts In-Stock

1+ parts

$0.900

100+ parts

-

1k+ parts

-

10k+ parts

-

444

$0.900

-

-

-

Corohmni

South Africa . 104 parts In-Stock

1+ parts

$0.943

100+ parts

-

1k+ parts

-

10k+ parts

-

104

$0.943

-

-

-

AZTECH Wire

Italy . 1,157 parts In-Stock

1+ parts

$9.400

100+ parts

-

1k+ parts

-

10k+ parts

-

1,157

$9.400

-

-

-

Kulean Microsystems

USA . 7,061 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,061

-

-

-

-

Problanco Electronics

Mexico . 4,120 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,120

-

-

-

-

TANS Electronics

Latvia . 3,672 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,672

-

-

-

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SupplyDigital Components

Austria . 1,422 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,422

-

-

-

-

Continental Prestige Electronics

USA . 882 parts In-Stock

1+ parts

-

100+ parts

$0.892

1k+ parts

-

10k+ parts

-

882

-

$0.892

-

-

UHIMA Technologies

Türkiye . 744 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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744

-

-

-

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Microchip USA

USA . 421 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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421

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-

-

-

Overview

Experience superior performance and reliability with the NCS2502DG operational amplifier by Onsemi. As a renowned manufacturer in the industry, Onsemi delivers top-quality products that meet the highest standards. The NCS2502DG is perfect for a wide range of applications, providing customers with unparalleled value and benefits. Trust Onsemi for all your operational amplifier needs and elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product durable and lightweight, ideal for portable and industrial applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during production.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact footprint and efficient use of space on the circuit board.

No. of Terminals: 8

Having 8 terminals allows for versatile connectivity options and compatibility with a wide range of circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact electronic devices.

Terminal Finish: TIN

The use of tin as the terminal finish provides good conductivity and solderability, ensuring reliable connections.

Terminal Position: DUAL

The dual terminal position offers more flexibility in circuit layout and connection arrangements.

Maximum Seated Height: 1.75 mm

The low maximum seated height allows for a slim profile and compact design, suitable for space-constrained applications.

Width: 3.9 mm

The narrow width facilitates close placement of components on the PCB, enabling efficient use of space.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the product can withstand the rigors of soldering processes without compromising performance.

Length: 4.9 mm

The compact length of the product contributes to space-saving on the PCB and overall size reduction of the electronic device.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliability and stability of operation in harsh environments and demanding conditions.

Technology: BIPOLAR

The bipolar technology used in the product offers high precision and low noise performance, making it suitable for sensitive signal processing applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable solder joints, enhancing the overall durability and longevity of the product.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, the product is designed for high-gain, differential signal amplification, making it versatile for various analog signal processing tasks.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for precise placement of components on the PCB, optimizing the electrical performance and efficiency of the circuit design.

Technical Specifications

Operational Amplifiers (Op Amps) NCS2502DG attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Onsemi

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Total Functions:

1

Sub-Category:

Operational Amplifiers

Operational Characteristics

Peak Reflow Temperature:

260 °C (500 °F)

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Tin

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Trade Compliance

NCS2502DG Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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