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NCP81382MNTXG

Onsemi

NCP81382MNTXG by Onsemi

NCP81382MNTXG by Onsemi is a MOSFET gate driver with a max supply voltage of 5.5V and a min supply voltage of 4.5V. It is surface mountable and has a package style of CHIP CARRIER, HEAT SINK/SLUG. This driver is commonly used in industrial applications for driving high side MOSFETs.

Median Price

$1.570

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 747,500 parts In-Stock

1+ parts

$1.430

100+ parts

$1.400

1k+ parts

$1.370

10k+ parts

-

747,500

$1.430

$1.400

$1.370

-

Farnell

UK . 1,433 parts In-Stock

1+ parts

$1.570

100+ parts

$1.050

1k+ parts

$0.767

10k+ parts

$0.715

1,433

$1.570

$1.050

$0.767

$0.715

Element14

Singapore . 1,774 parts In-Stock

1+ parts

$3.090

100+ parts

$2.090

1k+ parts

$1.520

10k+ parts

$1.310

1,774

$3.090

$2.090

$1.520

$1.310

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 290 parts In-Stock

1+ parts

$1.054

100+ parts

-

1k+ parts

-

10k+ parts

-

290

$1.054

-

-

-

Nova Conductors

Japan . 81 parts In-Stock

1+ parts

$1.064

100+ parts

-

1k+ parts

-

10k+ parts

-

81

$1.064

-

-

-

Chip Stock

USA . 23,978 parts In-Stock

1+ parts

-

100+ parts

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23,978

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-

-

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Vyrian

USA . 2,011 parts In-Stock

1+ parts

-

100+ parts

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2,011

-

-

-

-

Cyclops Electronics Ltd

UK . 181 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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181

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,531 parts In-Stock

1+ parts

$0.940

100+ parts

-

1k+ parts

-

10k+ parts

-

4,531

$0.940

-

-

-

Corphita

USA . 1,891 parts In-Stock

1+ parts

$0.999

100+ parts

-

1k+ parts

-

10k+ parts

-

1,891

$0.999

-

-

-

Bastille Electronics

Australia . 82 parts In-Stock

1+ parts

$1.064

100+ parts

$1.011

1k+ parts

$0.960

10k+ parts

$0.947

82

$1.064

$1.011

$0.960

$0.947

Corohmni

South Africa . 427 parts In-Stock

1+ parts

$1.110

100+ parts

-

1k+ parts

-

10k+ parts

-

427

$1.110

-

-

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Continental Prestige Electronics

USA . 2,500 parts In-Stock

1+ parts

$2.100

100+ parts

$1.210

1k+ parts

-

10k+ parts

-

2,500

$2.100

$1.210

-

-

AZTECH Wire

Italy . 691 parts In-Stock

1+ parts

$12.960

100+ parts

-

1k+ parts

-

10k+ parts

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691

$12.960

-

-

-

Perfect Parts

USA . 41,065 parts In-Stock

1+ parts

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41,065

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Problanco Electronics

Mexico . 7,038 parts In-Stock

1+ parts

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7,038

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Lixinc

USA . 6,743 parts In-Stock

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6,743

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Kulean Microsystems

USA . 6,174 parts In-Stock

1+ parts

-

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6,174

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-

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Kepictronics

USA . 4,300 parts In-Stock

1+ parts

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100+ parts

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4,300

-

-

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TANS Electronics

Latvia . 2,684 parts In-Stock

1+ parts

-

100+ parts

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2,684

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A-Z Elektronik GmbH

Germany . 2,507 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,507

-

-

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SupplyDigital Components

Austria . 2,145 parts In-Stock

1+ parts

-

100+ parts

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2,145

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-

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Microchip USA

USA . 1,783 parts In-Stock

1+ parts

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100+ parts

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1,783

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Futuretech Components

Singapore . 680 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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680

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-

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UHIMA Technologies

Türkiye . 460 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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460

-

-

-

-

Overview

Experience the power of high-quality MOSFET gate drivers with the NCP81382MNTXG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers exceptional performance and reliability you can trust. Whether you're designing audio amplifiers, motor controllers, or power supplies, this versatile chip carrier with a rectangular shape is perfect for surface mount applications. With a wide temperature range and industrial-grade durability, the NCP81382MNTXG ensures optimal performance even in challenging environments. Unlock the potential of your designs with the value, benefits, and advantages that this top-notch gate driver offers. Trust Onsemi to elevate your projects to new heights.

Feature Benefit Bullets

Surface Mount: YES

Surface mount allows for easy and efficient installation onto a PCB, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

Can handle higher supply voltages, providing flexibility and compatibility with a wide range of systems.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and allows for easy integration into existing circuit designs.

No. of Terminals: 36

Multiple terminals provide versatile connection options, allowing for customization and adaptation to various setups.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG

The combination of chip carrier and heat sink/slug package styles ensures efficient heat dissipation, improving overall performance and reliability.

Minimum Supply Voltage: 4.5 V

Can operate at lower supply voltages, making it suitable for a wide range of applications with varying power requirements.

Maximum Operating Temperature: 100 °C

High maximum operating temperature ensures durability and reliability even in demanding working conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in harsh environments with extreme temperatures, ensuring consistent performance.

Terminal Finish: MATTE TIN

Matte tin finish provides a reliable and durable terminal surface, ensuring secure connections and long-term performance.

Terminal Position: QUAD

Quad terminal position allows for easy and straightforward connection to other components or devices.

Maximum Seated Height: 1.2 mm

Low seated height is beneficial for space-constrained applications, enabling a compact and efficient design.

Width: 4 mm

Narrow width saves space on the PCB, allowing for a more streamlined and compact overall system design.

High Side Driver: YES

High side driver functionality enables the efficient control and management of high-side power MOSFETs in circuit applications.

Maximum Time At Peak Reflow Temperature (s): 30

Long maximum time at peak reflow temperature allows for adequate reflow soldering process, ensuring secure and reliable connections.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability supports lead-free soldering processes, complying with modern environmental standards.

Length: 6 mm

Compact length contributes to a space-efficient design, facilitating integration into various circuit layouts.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in industrial applications with harsh environmental conditions.

Terminal Form: NO LEAD

No-lead terminal form reduces the risk of solder joint fatigue, enhancing overall product durability and longevity.

Maximum Supply Current: 20 mA

Low maximum supply current consumption helps in reducing power consumption and heat generation, improving overall energy efficiency.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage simplifies integration into various systems and ensures compatibility with common power sources.

Terminal Pitch: 0.4 mm

Fine terminal pitch enables precise connections and facilitates high-density PCB layouts for compact system designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, allowing for safe and reliable storage and handling of the product.

Nominal Output Peak Current Limit: 70 A

High nominal output peak current limit supports robust and efficient power handling capabilities, suitable for demanding applications.

Interface IC Type: BUFFER OR INVERTER BASED MOSFET DRIVER

Versatile interface IC type enables flexible signal processing and control, adapting to different circuit requirements and configurations.

Technical Specifications

MOSFET Gate Drivers NCP81382MNTXG attributes and parameters. Explore more MOSFET Gate Drivers devices from Onsemi

Specs

High Side Driver:

YES

JESD-30 Code:

R-XQCC-N36

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Peak Current Limit:

70 A

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

NCP81382MNTXG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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