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NCP81071AMNTXG

Onsemi

NCP81071AMNTXG by Onsemi

NCP81071AMNTXG by Onsemi is a MOSFET Gate Driver with 2 functions, operating at -40 to 140 °C. It has a supply voltage range of 4.5-20 V and is ideal for automotive applications requiring a compact, surface-mountable driver with a small outline package style.

Median Price

$0.670

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 18,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

$0.630

18,000

-

-

-

$0.630

Rochester

USA . 1,897 parts In-Stock

1+ parts

-

100+ parts

$0.711

1k+ parts

$0.590

10k+ parts

$0.526

1,897

-

$0.711

$0.590

$0.526

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 669 parts In-Stock

1+ parts

$0.554

100+ parts

-

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669

$0.554

-

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Vyrian

USA . 8,976 parts In-Stock

1+ parts

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8,976

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Flip Electronics

USA . 3,000 parts In-Stock

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3,000

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Chip Stock

USA . 145 parts In-Stock

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145

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,528 parts In-Stock

1+ parts

$0.525

100+ parts

-

1k+ parts

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10k+ parts

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1,528

$0.525

-

-

-

Corohmni

South Africa . 139 parts In-Stock

1+ parts

$0.583

100+ parts

-

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-

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139

$0.583

-

-

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Vigor

Singapore . 970 parts In-Stock

1+ parts

$0.590

100+ parts

-

1k+ parts

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10k+ parts

-

970

$0.590

-

-

-

Andel Nordic

Denmark . 220 parts In-Stock

1+ parts

$0.880

100+ parts

-

1k+ parts

$0.613

10k+ parts

$0.613

220

$0.880

-

$0.613

$0.613

Component Stockers USA

USA . 5,391 parts In-Stock

1+ parts

$1.360

100+ parts

$0.780

1k+ parts

$0.580

10k+ parts

-

5,391

$1.360

$0.780

$0.580

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Microchip USA

USA . 5,708 parts In-Stock

1+ parts

$4.051

100+ parts

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1k+ parts

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5,708

$4.051

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SupplyDigital Components

Austria . 8,147 parts In-Stock

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8,147

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QUARKTWIN TECHNOLOGY LTD

USA . 5,339 parts In-Stock

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5,339

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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TANS Electronics

Latvia . 2,072 parts In-Stock

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2,072

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Kulean Microsystems

USA . 614 parts In-Stock

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614

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UHIMA Technologies

Türkiye . 473 parts In-Stock

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473

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Problanco Electronics

Mexico . 345 parts In-Stock

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345

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Overview

Get ready to take your applications to the next level with the NCP81071AMNTXG by Onsemi. This high-quality MOSFET gate driver offers unparalleled performance and reliability, thanks to the expertise of its manufacturer. Ideal for automotive use, this compact and versatile device provides seamless power supply and maximum efficiency. Say goodbye to technical hurdles and hello to seamless operation with the NCP81071AMNTXG - the perfect solution for all your gate driver needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to harsh environmental conditions, making this product reliable for long-term use.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 20 V

With a high maximum supply voltage, this MOSFET gate driver can handle a wide range of power supply inputs, providing flexibility in different applications.

No. of Functions: 2

Having multiple functions packed into a single device simplifies circuit design and reduces the need for additional components, leading to cost savings.

Package Shape: SQUARE

The square package shape offers efficient use of space on the PCB, allowing for a compact and organized layout in electronic designs.

Power Supplies (V): 12

Operating at a nominal supply voltage of 12V, this MOSFET gate driver is suitable for a wide range of industrial and automotive applications.

No. of Terminals: 8

The 8 terminals provide multiple connection points for interfacing with external components, enabling versatile integration in various circuit configurations.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style ensures efficient heat dissipation and space-saving design, making it ideal for compact electronic devices.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage requirement allows for operation in low-power scenarios, increasing energy efficiency and reducing power consumption.

Maximum Operating Temperature: 140 °C

With a high maximum operating temperature, this MOSFET gate driver can withstand extreme heat conditions, ensuring reliable performance in harsh environments.

Minimum Operating Temperature: -40 °C

The wide operating temperature range from -40 °C to 140°C enables reliable operation in both cold and hot climates, making it suitable for automotive applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and corrosion resistance, ensuring stable electrical connections and longevity of the device.

Terminal Position: DUAL

The dual terminal position allows for versatile mounting options and easy access to the connections, facilitating installation and maintenance of the MOSFET gate driver.

Maximum Seated Height: 0.8 mm

With a low maximum seated height of 0.8mm, this MOSFET gate driver is suitable for compact electronic devices with limited vertical space.

Width: 3 mm

The small width of 3mm enables a space-efficient layout on the PCB, contributing to a tidy and organized circuit design.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper solder reflow and reliable assembly during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C allows for lead-free soldering, meeting industry standards for environmentally friendly manufacturing practices.

Length: 3 mm

The compact length of 3mm contributes to the overall small form factor of the MOSFET gate driver, making it suitable for space-constrained applications.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this MOSFET gate driver meets stringent requirements for temperature resistance and reliability in vehicle electronics.

Terminal Form: NO LEAD

The no lead terminal form ensures compliance with RoHS regulations and simplifies the manufacturing process by eliminating the use of lead-based materials.

Nominal Supply Voltage: 12 V

Operating at a nominal supply voltage of 12V, this MOSFET gate driver is compatible with standard power sources, making it easy to integrate into existing systems.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm allows for high-density mounting on the PCB, reducing signal interference and improving overall circuit performance.

Interface IC Type: BUFFER OR INVERTER BASED MOSFET DRIVER

The buffer or inverter based interface IC type offers flexibility in driving MOSFETs with different control signals, allowing for customized circuit configurations and optimized performance.

Technical Specifications

MOSFET Gate Drivers NCP81071AMNTXG attributes and parameters. Explore more MOSFET Gate Drivers devices from Onsemi

Specs

High Side Driver:

NO

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

140 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC8,.12SQ,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Voltage:

20 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NCP81071AMNTXG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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