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NCP694D12HT1G

Onsemi

NCP694D12HT1G by Onsemi

NCP694D12HT1G by Onsemi is a Fixed Positive Single Output LDO Regulator with 0.32V dropout voltage, 1.2V nominal output, and 0.3A max current. Ideal for applications requiring stable voltage regulation in compact spaces with operating temperatures from -40 to 85 °C.

Median Price

$0.700

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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DF Sales Co.

USA . 84 parts In-Stock

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$0.700

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DF Sales Co.

USA . 84 parts In-Stock

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$0.700

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Vyrian

USA . 8,422 parts In-Stock

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Digiode

USA . 1,400 parts In-Stock

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Chip Stock

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Semtec, LLC

USA . 5 parts In-Stock

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Semi Source

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Corohmni

South Africa . 313 parts In-Stock

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AZTECH Wire

Italy . 1,047 parts In-Stock

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$12.950

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Kepictronics

USA . 306,000 parts In-Stock

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Kulean Microsystems

USA . 6,851 parts In-Stock

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Problanco Electronics

Mexico . 5,117 parts In-Stock

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SupplyDigital Components

Austria . 4,431 parts In-Stock

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TANS Electronics

Latvia . 4,282 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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Corphita

USA . 1,801 parts In-Stock

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UHIMA Technologies

Türkiye . 839 parts In-Stock

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Vigor

Singapore . 829 parts In-Stock

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Microchip USA

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Perfect Parts

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Overview

Enhance your electronic designs with the NCP694D12HT1G by Onsemi, a top-tier manufacturer known for producing high-quality components. This Fixed Regulator - Positive Single Output LDO offers unparalleled reliability and precision in voltage regulation, making it ideal for a wide range of applications. With its compact size and efficient performance, this product delivers exceptional value to customers seeking superior power management solutions. Upgrade your projects with the NCP694D12HT1G and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection for the regulator, making it suitable for various applications.

Maximum Dropout Voltage: 1.32 V

With a low dropout voltage, this regulator ensures efficient power conversion and minimal power loss.

Surface Mount: YES

Ease of installation and compact design for space-constrained applications.

Nominal Output Voltage: 1.2 V

Provides a stable output voltage for reliable operation of connected components.

Maximum Output Current: 0.3 A

Capable of delivering sufficient current to power various electronic devices or circuits.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP694D12HT1G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.32 V

Nominal Dropout Voltage-1:

.56 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

6 V

Minimum Input Voltage:

1.4 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

4.5 mm

Maximum Line Regulation:

.0091 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

85 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current-1:

.3 A

Minimum Output Voltage-1:

1.03 V

Nominal Output Voltage-1:

1.2 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

FL6,.1,60

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

Width:

2.5 mm

Trade Compliance

NCP694D12HT1G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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