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NCP606MN18T2G

Onsemi

NCP606MN18T2G by Onsemi

NCP606MN18T2G by Onsemi is a fixed positive single output LDO regulator with a max output current of 0.5A and a dropout voltage of 0.3V. It operates in an extended temperature range from -40 to 150°C, making it suitable for various applications requiring stable voltage regulation in compact spaces.

Median Price

$0.606

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 29,580 parts In-Stock

1+ parts

-

100+ parts

$0.594

1k+ parts

$0.493

10k+ parts

$0.440

29,580

-

$0.594

$0.493

$0.440

Verical

USA . 28,860 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.617

10k+ parts

$0.550

28,860

-

-

$0.617

$0.550

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 434 parts In-Stock

1+ parts

$0.463

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-

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434

$0.463

-

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$0.538

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150

$0.538

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Vyrian

USA . 7,977 parts In-Stock

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7,977

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Chip Stock

USA . 6,390 parts In-Stock

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6,390

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Distributors (Availability)

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Ampacity Inc.

Singapore . 30,349 parts In-Stock

1+ parts

$0.414

100+ parts

-

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30,349

$0.414

-

-

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Corphita

USA . 1,629 parts In-Stock

1+ parts

$0.438

100+ parts

-

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1,629

$0.438

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Corohmni

South Africa . 477 parts In-Stock

1+ parts

$0.487

100+ parts

-

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477

$0.487

-

-

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Continental Prestige Electronics

USA . 6,467 parts In-Stock

1+ parts

$0.538

100+ parts

-

1k+ parts

-

10k+ parts

$0.527

6,467

$0.538

-

-

$0.527

Argo Parts USA

USA . 1,921 parts In-Stock

1+ parts

$0.538

100+ parts

-

1k+ parts

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10k+ parts

$0.522

1,921

$0.538

-

-

$0.522

Semicontronic

India . 30,072 parts In-Stock

1+ parts

$0.900

100+ parts

$0.878

1k+ parts

$0.873

10k+ parts

-

30,072

$0.900

$0.878

$0.873

-

Aztec Data Supply Inc.

USA . 1,402 parts In-Stock

1+ parts

$7.660

100+ parts

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1,402

$7.660

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AZTECH Wire

Italy . 283 parts In-Stock

1+ parts

$12.060

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283

$12.060

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SupplyDigital Components

Austria . 7,637 parts In-Stock

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7,637

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Problanco Electronics

Mexico . 4,116 parts In-Stock

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Kepictronics

USA . 3,078 parts In-Stock

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3,078

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Kulean Microsystems

USA . 2,862 parts In-Stock

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Lixinc

USA . 2,482 parts In-Stock

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Formix International (Excess)

India . 2,102 parts In-Stock

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Infinite Electronics LLP (Excess)

. 1,061 parts In-Stock

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1,061

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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TANS Electronics

Latvia . 848 parts In-Stock

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848

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Microchip USA

USA . 377 parts In-Stock

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377

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UHIMA Technologies

Türkiye . 234 parts In-Stock

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234

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Netroflash

USA . 50 parts In-Stock

1+ parts

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100+ parts

$0.527

1k+ parts

$0.511

10k+ parts

$0.500

50

-

$0.527

$0.511

$0.500

Overview

Experience top-notch performance and reliability with the NCP606MN18T2G by Onsemi, a leading manufacturer in the industry. This fixed regulator offers a seamless solution for your power management needs, ensuring stable output voltage with minimal dropout. Perfect for a wide range of applications, this LDO regulator provides superior quality and efficiency while maintaining a compact design. Trust Onsemi to deliver unmatched value and innovation, making your projects run smoothly and efficiently. Elevate your electronics with the NCP606MN18T2G and experience the difference today.

Feature Benefit Bullets

Maximum Dropout Voltage-1: 1.3 V

Low dropout voltage ensures efficient operation and minimal power loss.

Surface Mount: YES

Surface mount technology allows for easy and space-saving integration onto PCBs.

Operating Temperature (TJ-Max): 150 °C

Wide operating temperature range makes this regulator suitable for various environments.

Technology: CMOS

CMOS technology offers high efficiency and low power consumption.

Package Shape: RECTANGULAR

Rectangular shape facilitates easy mounting and layout design.

Terminal Form: NO LEAD

No lead terminals reduce the risk of solder joint failures and improve reliability.

Operating Temperature (TJ-Min): -40 °C

Wide range of operating temperatures ensures functionality in extreme conditions.

Packing Method: TR

Tape and reel packing method is convenient for automated assembly processes.

Minimum Output Voltage-1: 1.764 V

Precise output voltage regulation for stable and reliable performance.

Maximum Voltage Tolerance: 2 %

Tight voltage tolerance ensures consistent output voltage under varying conditions.

Nominal Output Voltage-1: 1.8 V

Stable output voltage ideal for powering sensitive electronic components.

No. of Terminals: 6

Sufficient terminals for connectivity and secure installation.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Compact package design with heat sink ensures efficient heat dissipation and space-saving installation.

Adjustability: FIXED

Fixed output voltage eliminates the need for adjustment and simplifies circuit design.

Terminal Pitch: 0.95 mm

Close terminal pitch enables compact layout and efficient PCB design.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

LDO regulator provides stable output voltage with low dropout voltage for critical applications.

Terminal Finish: MATTE TIN

Matte tin finish ensures good solderability and long-term reliability.

Terminal Position: DUAL

Dual terminal configuration provides additional connection options for flexibility.

Maximum Output Voltage-1: 1.836 V

High maximum output voltage for compatibility with various load requirements.

Maximum Seated Height: 0.9 mm

Low profile design for space-constrained applications.

Width: 3 mm

Compact width for easy integration and space-saving layout design.

Minimum Input Voltage: 2.1 V

Wide input voltage range for versatile compatibility with different power sources.

Maximum Output Current-1: 0.5 A

High output current capability for powering a variety of electronic devices.

Maximum Time At Peak Reflow Temperature (s): 30

Reliable performance even during peak reflow processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance for robust manufacturing processes.

Nominal Dropout Voltage-1: 0.25 V

Low dropout voltage ensures efficient power conversion and minimal heat dissipation.

Length: 3.3 mm

Compact length for space-saving installation.

Maximum Input Voltage: 6 V

High maximum input voltage for compatibility with various power sources.

Maximum Input Voltage Absolute: 6.5 V

Wide input voltage absolute maximum rating for robust protection against voltage spikes.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP606MN18T2G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.3 V

Nominal Dropout Voltage-1:

.25 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

6 V

Minimum Input Voltage:

2.1 V

JESD-30 Code:

R-XDSO-N6

JESD-609 Code:

e3

Length:

3.3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

6

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.5 A

Maximum Output Voltage-1:

1.836 V

Minimum Output Voltage-1:

1.764 V

Nominal Output Voltage-1:

1.8 V

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC6,.13,38

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

2 %

Width:

3 mm

Trade Compliance

NCP606MN18T2G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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