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NCP694DSAN33T1G

Onsemi

NCP694DSAN33T1G by Onsemi

NCP694DSAN33T1G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 0.3A. It operates in a temperature range from -40°C to 85°C, making it suitable for various applications requiring stable voltage regulation in compact electronic devices. The package style is small outline, surface mountable, and has a terminal pitch of 0.95mm, ideal for space-constrained designs.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 6,714 parts In-Stock

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Prism Electronics

USA . 807 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Digiode

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$3.729

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$3.393

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$3.058

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50

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Ampacity Inc.

Singapore . 909 parts In-Stock

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$9.500

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AZTECH Wire

Italy . 750 parts In-Stock

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$19.496

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SupplyDigital Components

Austria . 5,161 parts In-Stock

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TANS Electronics

Latvia . 3,715 parts In-Stock

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Argo Parts USA

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Authorized Procurement Solutions

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Kulean Microsystems

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Continental Prestige Electronics

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Problanco Electronics

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Bastille Electronics

Australia . 600 parts In-Stock

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Microchip USA

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UHIMA Technologies

Türkiye . 340 parts In-Stock

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Corohmni

South Africa . 188 parts In-Stock

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Vigor

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Corphita

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Overview

Experience superior performance and reliability with the NCP694DSAN33T1G by Onsemi. As a leading manufacturer in the industry, Onsemi is renowned for delivering top-notch quality products. The NCP694DSAN33T1G falls under the category of Fixed Regulators - Positive Single Output LDO, making it ideal for various applications. With a nominal output voltage of 3.3V and a maximum output current of 0.3A, this product offers unparalleled value and benefits to customers. Trust Onsemi to provide you with a high-quality solution that meets your needs efficiently and effectively.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Maximum Dropout Voltage-1: 0.1 V

Low dropout voltage ensures efficient regulation of the output voltage even when the input voltage fluctuates slightly.

Surface Mount: YES

Surface mount capability makes it easy to integrate this regulator into compact electronic designs.

Operating Temperature (TJ-Max): 85 °C

Wide operating temperature range allows the regulator to be used in various environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high efficiency.

Package Shape: RECTANGULAR

Rectangular shape provides easy placement and mounting on PCBs.

Operating Temperature (TJ-Min): -40 °C

Wide temperature range ensures operation even in extreme cold conditions.

Minimum Output Voltage-1: 3.234 V

Stable minimum output voltage ensures reliable operation of the connected components.

Maximum Voltage Tolerance: 2 %

Low voltage tolerance ensures accurate and precise output voltage regulation.

Nominal Output Voltage-1: 3.3 V

Stable nominal output voltage suitable for powering various electronic components.

No. of Terminals: 6

Sufficient terminals for easy connectivity and integration in circuits.

Package Style (Meter): SMALL OUTLINE

Compact small outline package style saves board space and allows for high-density mounting.

Adjustability: FIXED

Fixed adjustability simplifies the design and eliminates the need for external adjustments.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures long-term reliability in demanding conditions.

Terminal Pitch: 0.95 mm

Close terminal pitch allows for a compact design and efficient board layout.

Maximum Line Regulation: 0.01122 %

Low line regulation ensures stable output voltage despite variations in input voltage.

Terminal Finish: TIN

TIN terminal finish provides good conductivity and solderability.

Maximum Output Current-1: 0.3 A

Sufficient output current capability to power a variety of electronic components.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a specified duration without damage.

Peak Reflow Temperature °C: 260

Can undergo peak reflow soldering process at high temperatures for reliable solder joints.

Nominal Dropout Voltage-1: 0.18 V

Low dropout voltage ensures efficient and reliable voltage regulation even with small input-output differentials.

Length: 2.9 mm

Compact length allows for space-saving integration in electronic circuits and devices.

Maximum Input Voltage: 6 V

Wide input voltage range allows flexibility in power supply options.

Maximum Input Voltage Absolute: 6.5 V

Absolute maximum input voltage ensures protection against overvoltage situations.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP694DSAN33T1G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.1 V

Nominal Dropout Voltage-1:

.18 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

6 V

Minimum Input Voltage:

1.4 V

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e3

Length:

2.9 mm

Maximum Line Regulation:

.01122 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

6

Operating Temperature (TJ-Max):

85 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current-1:

.3 A

Maximum Output Voltage-1:

3.366 V

Minimum Output Voltage-1:

3.234 V

Nominal Output Voltage-1:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.11,37

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

2 %

Width:

2.8 mm

Trade Compliance

NCP694DSAN33T1G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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