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NCP691MN33T2G

Onsemi

NCP691MN33T2G by Onsemi

NCP691MN33T2G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 1A. It features a small outline package style, very thin profile, and matte tin terminal finish. Ideal for applications requiring stable voltage regulation in compact electronic devices.

Median Price

$1.254

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,095 parts In-Stock

1+ parts

$1.254

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$1.254

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North Shore Components

USA . 2,959 parts In-Stock

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2,959

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Vyrian

USA . 2,035 parts In-Stock

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2,035

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,475 parts In-Stock

1+ parts

$1.188

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1,475

$1.188

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Corohmni

South Africa . 79 parts In-Stock

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$1.320

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79

$1.320

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Microchip USA

USA . 4,735 parts In-Stock

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$3.821

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4,735

$3.821

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AZTECH Wire

Italy . 1,085 parts In-Stock

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$8.330

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1,085

$8.330

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QUARKTWIN TECHNOLOGY LTD

USA . 7,906 parts In-Stock

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7,906

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iodParts Technologies Inc.

India . 6,800 parts In-Stock

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6,800

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Problanco Electronics

Mexico . 5,398 parts In-Stock

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SupplyDigital Components

Austria . 4,561 parts In-Stock

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TANS Electronics

Latvia . 3,469 parts In-Stock

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3,469

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Kulean Microsystems

USA . 586 parts In-Stock

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586

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UHIMA Technologies

Türkiye . 51 parts In-Stock

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Overview

Enhance your electronic designs with the NCP691MN33T2G by Onsemi, a top-tier manufacturer known for its quality and reliability. This Fixed Regulator - Positive Single Output LDO is perfect for various applications, offering precise output voltage control and efficient power management. With a compact design and high performance, this product provides customers with unmatched value, benefits, and advantages. Say goodbye to power fluctuations and hello to seamless operations with the NCP691MN33T2G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the regulator easy to handle and resistant to damage during handling and installation.

Maximum Dropout Voltage-1: 1.25 V

Low dropout voltage ensures efficient regulation of the output voltage even when the input voltage is close to the output voltage, leading to minimal power loss.

Operating Temperature (TJ-Max): 125 °C

Wide operating temperature range allows the regulator to function reliably in various environmental conditions without overheating or performance degradation.

Nominal Output Voltage-1: 3.3 V

Provides a stable output voltage of 3.3V, which is commonly used in many electronic devices, ensuring compatibility with a wide range of applications.

Maximum Output Current-1: 1 A

Capable of delivering up to 1A of output current, making it suitable for powering a variety of electronic components and circuits.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP691MN33T2G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.25 V

Nominal Dropout Voltage-1:

.18 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

6 V

Minimum Input Voltage:

3.55 V

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e3

Length:

3 mm

Maximum Line Regulation:

.008 %

Maximum Load Regulation:

.035 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

6

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

1 A

Maximum Output Voltage-1:

3.366 V

Minimum Output Voltage-1:

3.234 V

Nominal Output Voltage-1:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.12,38

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

1 mm

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

2 %

Width:

3 mm

Trade Compliance

NCP691MN33T2G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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