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NCP6132AMNR2G

Onsemi

NCP6132AMNR2G by Onsemi

NCP6132AMNR2G by Onsemi is a 60-terminal switching regulator with max. operating temp of 100°C and current-mode control. It's a surface-mount chip carrier suitable for applications requiring high switching frequency up to 800 kHz, such as power management systems.

Median Price

$1.340

Lifecycle Status

EOL

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 77,814 parts In-Stock

1+ parts

$1.340

100+ parts

$1.310

1k+ parts

$1.290

10k+ parts

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77,814

$1.340

$1.310

$1.290

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Distributors (In-Stock)

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Vyrian

USA . 8,792 parts In-Stock

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8,792

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Chip Stock

USA . 4,500 parts In-Stock

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4,500

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Digiode

USA . 1,112 parts In-Stock

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Nova Conductors

Japan . 26 parts In-Stock

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26

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Distributors (Availability)

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Vigor

Singapore . 809 parts In-Stock

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$0.900

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809

$0.900

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Ampacity Inc.

Singapore . 419 parts In-Stock

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$4.500

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419

$4.500

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AZTECH Wire

Italy . 864 parts In-Stock

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$12.340

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864

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SupplyDigital Components

Austria . 6,998 parts In-Stock

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Problanco Electronics

Mexico . 6,280 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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Kulean Microsystems

USA . 2,158 parts In-Stock

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Microchip USA

USA . 1,916 parts In-Stock

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TANS Electronics

Latvia . 1,338 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 936 parts In-Stock

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Corphita

USA . 428 parts In-Stock

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Corohmni

South Africa . 424 parts In-Stock

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Overview

Looking for a reliable and efficient solution for your power management needs? Look no further than the NCP6132AMNR2G by Onsemi. With a reputation for quality and innovation, Onsemi delivers cutting-edge technology in the form of switching regulators & controllers. Whether you are working on consumer electronics, automotive applications or industrial equipment, this product offers unparalleled value and benefits. Say goodbye to power fluctuations and hello to optimized performance with the NCP6132AMNR2G. Trust Onsemi to provide you with the best in power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or long-lasting applications.

Surface Mount: YES

Being surface mountable allows for easy integration into compact electronic devices, saving space and simplifying assembly processes.

Package Shape: SQUARE

Square package shape is typically more stable and easier to mount, providing better mechanical support for the internal components.

No. of Terminals: 60

Having a high number of terminals allows for more connections and flexibility in the circuit design, enabling complex functionalities.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature ensures reliable performance even in demanding environments with elevated temperatures.

Control Mode: CURRENT-MODE

Current-mode control offers improved transient response and stability, making the product suitable for applications requiring precise current regulation.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the product can withstand the soldering process without compromising its functionality.

Maximum Switching Frequency: 800 kHz

The high maximum switching frequency allows for faster response times and more efficient power conversion, enhancing overall performance.

Technical Specifications

Switching Regulators & Controllers NCP6132AMNR2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Control Mode:

CURRENT-MODE

JESD-30 Code:

S-PQCC-N60

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

60

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC60,.27SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Maximum Switching Frequency:

800 kHz

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NCP6132AMNR2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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