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NCP6332BMTAATBG

Onsemi

NCP6332BMTAATBG by Onsemi

NCP6332BMTAATBG by Onsemi is a VOLTAGE-MODE BUCK SWITCHING REGULATOR with 2.3-5.5V input, 1.8V output, and 2.2A max current. Ideal for industrial applications requiring high efficiency and compact design due to its small outline, low profile package style, and high switching frequency of 3300 kHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,052 parts In-Stock

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5,052

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Digiode

USA . 1,790 parts In-Stock

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Prism Electronics

USA . 100 parts In-Stock

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100

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Distributors (Availability)

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AZTECH Wire

Italy . 1,073 parts In-Stock

1+ parts

$21.320

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Kulean Microsystems

USA . 6,272 parts In-Stock

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Problanco Electronics

Mexico . 4,302 parts In-Stock

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Corphita

USA . 1,844 parts In-Stock

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TANS Electronics

Latvia . 1,119 parts In-Stock

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Infinite Electronics LLP (Excess)

. 442 parts In-Stock

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442

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Microchip USA

USA . 416 parts In-Stock

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416

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SupplyDigital Components

Austria . 312 parts In-Stock

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312

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UHIMA Technologies

Türkiye . 264 parts In-Stock

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Corohmni

South Africa . 165 parts In-Stock

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Overview

Experience superior quality and reliability with the NCP6332BMTAATBG by Onsemi, a leading manufacturer of cutting-edge switching regulators & controllers. This versatile product offers a wide range of applications, delivering exceptional performance in various industrial settings. With its advanced features and innovative design, this small outline, heat sink package provides customers with unmatched value and benefits. Trust Onsemi to deliver top-notch products that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Operating Temperature: 85 °C

The high operating temperature range ensures reliability and stability even under harsh environmental conditions.

Nominal Input Voltage: 3.6 V

The nominal input voltage of 3.6V is versatile and compatible with a wide range of applications, providing flexibility in design.

Maximum Output Current: 2.2 A

The high maximum output current of 2.2A allows the product to power a variety of loads, making it suitable for different power requirements.

Control Technique: PULSE WIDTH MODULATION

The use of pulse width modulation control technique ensures efficient power conversion and regulation, enhancing overall performance.

Technical Specifications

Switching Regulators & Controllers NCP6332BMTAATBG attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Additional Features:

ADJUSTABLE OUTPUT VOLTAGE RANGE FROM 0.6 V TO 5.5 V, ALSO OPERATES IN PFM CONTROL TECHNIQUE

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

2.3 V

Nominal Input Voltage:

3.6 V

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

2.2 A

Nominal Output Voltage:

1.8 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

3300 kHz

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width (mm):

2 mm

Trade Compliance

NCP6332BMTAATBG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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