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NCP4683DSQ18T1G

Onsemi

NCP4683DSQ18T1G by Onsemi

NCP4683DSQ18T1G by Onsemi is a CMOS LDO regulator with 1.8V output voltage, 0.3A output current, and 0.39V dropout voltage. It is ideal for applications requiring stable power supply in compact spaces due to its small outline package and low load regulation of 0.04%.

Median Price

$0.425

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1,531 parts In-Stock

1+ parts

$2.150

100+ parts

$0.728

1k+ parts

$0.536

10k+ parts

-

1,531

$2.150

$0.728

$0.536

-

Rochester

USA . 26,303 parts In-Stock

1+ parts

-

100+ parts

$0.409

1k+ parts

$0.340

10k+ parts

$0.303

26,303

-

$0.409

$0.340

$0.303

Verical

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.425

10k+ parts

$0.379

12,000

-

-

$0.425

$0.379

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 455 parts In-Stock

1+ parts

$0.319

100+ parts

-

1k+ parts

-

10k+ parts

-

455

$0.319

-

-

-

Vyrian

USA . 7,869 parts In-Stock

1+ parts

-

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-

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7,869

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,378 parts In-Stock

1+ parts

$0.302

100+ parts

-

1k+ parts

-

10k+ parts

-

2,378

$0.302

-

-

-

Vigor

Singapore . 718 parts In-Stock

1+ parts

$0.320

100+ parts

-

1k+ parts

-

10k+ parts

-

718

$0.320

-

-

-

Corohmni

South Africa . 289 parts In-Stock

1+ parts

$0.336

100+ parts

-

1k+ parts

-

10k+ parts

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289

$0.336

-

-

-

AZTECH Wire

Italy . 478 parts In-Stock

1+ parts

$16.950

100+ parts

-

1k+ parts

-

10k+ parts

-

478

$16.950

-

-

-

Continental Prestige Electronics

USA . 20,303 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.285

10k+ parts

-

20,303

-

-

$0.285

-

Perfect Parts

USA . 11,525 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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11,525

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Kulean Microsystems

USA . 6,373 parts In-Stock

1+ parts

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6,373

-

-

-

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Problanco Electronics

Mexico . 5,892 parts In-Stock

1+ parts

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5,892

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TANS Electronics

Latvia . 4,712 parts In-Stock

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4,712

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Authorized Procurement Solutions

USA . 1,553 parts In-Stock

1+ parts

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100+ parts

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1,553

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GreenTree Electronics

Israel . 1,531 parts In-Stock

1+ parts

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1,531

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UHIMA Technologies

Türkiye . 598 parts In-Stock

1+ parts

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598

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SupplyDigital Components

Austria . 426 parts In-Stock

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426

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Kepictronics

USA . 330 parts In-Stock

1+ parts

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330

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Microchip USA

USA . 169 parts In-Stock

1+ parts

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169

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Overview

Elevate your power management capabilities with the NCP4683DSQ18T1G by Onsemi. This fixed positive single output LDO regulator offers superior quality and reliability, thanks to Onsemi's reputable manufacturing standards. Ideal for a wide range of applications, this regulator provides stable output voltage with minimal dropout, ensuring optimal performance in your electronic devices. Experience the value and benefits of this product, including precise voltage regulation, compact design, and efficient power delivery. Upgrade your projects with the NCP4683DSQ18T1G and unleash the full potential of your electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection, making the product reliable in various environments.

Maximum Dropout Voltage-1: 1.39 V

Low dropout voltage ensures efficient power conversion, minimizing energy loss.

Surface Mount: YES

Surface mount design allows for easy and space-saving installation on PCBs.

Operating Temperature (TJ-Max): 150 °C

Wide operating temperature range enables the product to perform reliably in different temperature conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency of the product.

Minimum Output Voltage-1: 1.74 V

Stable minimum output voltage ensures consistent performance of connected devices.

Nominal Output Voltage-1: 1.8 V

Accurate nominal output voltage provides precise power delivery to the load.

No. of Terminals: 5

Sufficient number of terminals for easy connectivity and integration into the system.

Terminal Finish: Tin (Sn)

Tin finish on terminals offers good conductivity and corrosion resistance.

Maximum Output Current-1: 0.3 A

High maximum output current capability allows the product to power various devices with ease.

Technical Specifications

Fixed Regulators - Positive Single Output LDO NCP4683DSQ18T1G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Maximum Dropout Voltage-1:

.39 V

Nominal Dropout Voltage-1:

.3 V

Maximum Input Voltage:

5.25 V

Minimum Input Voltage:

1.4 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Maximum Load Regulation:

.04 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.3 A

Maximum Output Voltage-1:

1.86 V

Minimum Output Voltage-1:

1.74 V

Nominal Output Voltage-1:

1.8 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification Status:

Not Qualified

Maximum Seated Height:

1.1 mm

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Voltage Tolerance:

Width:

1.25 mm

Trade Compliance

NCP4683DSQ18T1G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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